A new technical paper titled “A color-coded light-induced heating technology for Pb-free solder joints of advanced multi-semiconductor packaging” was published by researchers at Sungkyunkwan University.
Excerpt from paper:
“This study introduces a color-coded intense pulsed light (IPL) reflow process, leveraging differential light absorption for localized thermal modulation, enabling simultaneous soldering of multiple alloys in a single reflow cycle. The results show that IPL-soldered joints exhibit superior or comparable mechanical integrity to conventional reflow, with thinner, more stable intermetallic compound (IMC) layers, refined Ag3Sn precipitates, and reduced void formation, enhancing reliability.”
Find the technical paper here. November 2025.
Noh, Taejoon, Ho-Kyeong Seong, Minjae Sung, Jaejun Yoon, Jong-Woong Kim, and Seung-Boo Jung. “A Color-Coded Light-Induced Heating Technology for Pb-Free Solder Joints of Advanced Multi-Semiconductor Packaging.” Journal of Materials Research and Technology (2025). Creative commons license.