The platform coordinates AI agents across planning, implementation and multiphysics analysis for PCB and packaging design.

Cadence has introduced the AuraStack AI Super Agent on Cadence Allegro AI Studio, an agentic AI platform for printed circuit board (PCB) and advanced packaging design. The platform is designed to support designers from system planning through final product development in an AI-native environment.

With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack, InnoStack and ViraStack AI Super Agents.

The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation, and integrated multiphysics analysis. It is intended to help shorten the system-design cycle through manufacturing.

With AuraStack, Cadence adds agentic AI capabilities for PCB and advanced packaging design, building on its ChipStack, InnoStack, and ViraStack AI Super Agents for other parts of the electronic system design flow.

Agentic AI for packaging and PCB design

The AuraStack AI Super Agent uses the same architecture as Cadence’s ChipStack AI Super Agent. It combines agentic AI with simulation and optimization tools to support design exploration, implementation, and signoff.

The platform brings together automation and optimization for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability, and multiphysics analysis across Cadence’s system design and analysis portfolio.

AuraStack includes a multiphysics foundation for modeling and optimizing electrical, thermal, and mechanical behavior. This includes signal integrity and power integrity, thermal analysis, mechanical stress, drop, vibration, and fatigue analysis within a closed-loop environment. The approach is designed to support earlier tradeoff evaluation and product-level optimization across the design flow.

The multiphysics feedback loop is intended to support design convergence during development, reduce late-stage issues, and improve system reliability.

Key benefits of the AuraStack AI Super Agent include:

Supporting shorter development cycles through task automation and broader design exploration

Providing a shared, multiphysics-aware design environment for engineering teams across domains

Supporting earlier and continuous multiphysics co-optimization to reduce late-stage rework and design iterations

Integrating Cadence multiphysics signoff solutions, including Celsius Thermal Solver, Clarity 3D Solver for 3D-EM, MSC Nastran and Marc Linear and Non-Linear Finite Element Analysis Solvers for mechanical analysis, and Sigrity X Platform for signal and power integrity

Helping identify system issues earlier in development to reduce the likelihood of respins

Supporting product-level optimization, including co-optimization with advanced packaging approaches

Industry collaborations

Cadence is working with industry companies to deploy AuraStack AI Super Agent workflows for advanced IC packaging and PCB design applications.

NVIDIA is using Cadence tools to support automation and optimization of system design workflows for its engineering teams.

Cadence is working with TSMC to help customers use AI-driven automation for advanced package implementation and design convergence in multi-die systems.

Socionext is using Cadence tools to support automation and optimization of semiconductor package and PCB design workflows.

FORVIA HELLA is continuing work on electronic systems for automotive technology.

Schneider Electric is working with Cadence to apply AI-driven design automation and engineering expertise to electronic design workflows and engineering knowledge sharing.

The Cadence AuraStack AI Super Agent is expected to be available in 2026.

For more information, visit cadence.com.