HBM, Agentic AI Platform for PCB Design, Ku-Band RFoF Transmitter: Embedded Week Insights
Here’s a roundup of this week’s must-read articles. We’ll look into the latest developments in high-bandwidth memory, Cadence’s agentic AI platform for PCB Design, and a Ku-Band RFoF transmitter.
Also, check News Archives – Embedded and Technical Articles Archives – Embedded for the complete list of news and articles from our website.
NEWS
A collaboration between Celus, Variscite, and NXP accelerates embedded system design.
New AI memory architectures, 400+ layer V-NAND, and next-generation HBM technologies target future AI systems.
The open-source profiling tool helps optimize AI performance, memory usage, and power consumption on Ambiq Apollo SoCs.
The BG2B Bluetooth LE wireless SoC delivers high power efficiency, security, and integration.
The compact RF-over-fiber transmitter enables direct transport of Ku-band signals in space-constrained defense and aerospace systems.
You can find more news here: News Archives, Products Archives
ARTICLES
HBM dramatically increases bandwidth, but latency, power, and data locality still matter, so last-level caches have become more, not less, important.
The AuraStack AI super agent coordinates advanced PCB and package design with simulation and sign-off but leaves application-specific tradeoffs to engineers.
You can find more articles here: Technical Articles Archives – Embedded, Analysis Archives – Embedded