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semiconductor packaging;photonic integration;Artificial Intelligence;Microelectronics;Advanced Materials;data centers;Interdisciplinary Collaboration;Energy Efficiency

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Professor Ching Ping Wong Explores Advanced Semiconductor and Photonic Packaging for AI at CityUHK
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Professor Ching Ping Wong Explores Advanced Semiconductor and Photonic Packaging for AI at CityUHK

  • August 4, 2026
Newswise — Professor Ching Ping Wong, an HKIAS Senior Fellow and a pioneering figure in materials science and…
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