\t\t\tHBM, Agentic AI Platform for PCB Design, Ku-Band RFoF Transmitter: Embedded Week Insights\t<\/p>\n
Here\u2019s a roundup of this week\u2019s must-read articles. We\u2019ll look into the latest developments in high-bandwidth memory, Cadence\u2019s agentic AI platform for PCB Design, and a Ku-Band RFoF transmitter.<\/p>\n
Also, check\u00a0News Archives \u2013 Embedded<\/a>\u00a0and\u00a0Technical Articles Archives \u2013 Embedded<\/a>\u00a0for the complete list of news and articles from our website.<\/p>\n NEWS<\/p>\n A collaboration between Celus, Variscite, and NXP accelerates embedded system design.<\/p>\n New AI memory architectures, 400+ layer V-NAND, and next-generation HBM technologies target future AI systems.<\/p>\n The open-source profiling tool helps optimize AI performance, memory usage, and power consumption on Ambiq Apollo SoCs.<\/p>\n The BG2B Bluetooth LE wireless SoC delivers high power efficiency, security, and integration.<\/p>\n The compact RF-over-fiber transmitter enables direct transport of Ku-band signals in space-constrained defense and aerospace systems.<\/p>\n You can find more news here:\u00a0News Archives<\/a>, Products Archives<\/a><\/p>\n ARTICLES<\/p>\n HBM dramatically increases bandwidth, but latency, power, and data locality still matter, so last-level caches have become more, not less, important.<\/p>\n The AuraStack AI super agent coordinates advanced PCB and package design with simulation and sign-off but leaves application-specific tradeoffs to engineers.<\/p>\n You can find more articles here:\u00a0Technical Articles Archives \u2013 Embedded<\/a>, Analysis Arc<\/a>h<\/a>ives \u2013 Embedded<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"HBM, Agentic AI Platform for PCB Design, Ku-Band RFoF Transmitter: Embedded Week Insights Here\u2019s a roundup of this…\n","protected":false},"author":2,"featured_media":72293,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"tags":[179,7493,24,66523,13543,7397,52115,66524],"class_list":["post-133923","post","type-post","status-publish","format-standard","has-post-thumbnail","category-agentic-ai","tag-agentic-ai","tag-agentic-artificial-intelligence","tag-ai","tag-components","tag-development-tools","tag-memory","tag-pcbs","tag-rf-microwave"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/posts\/133923","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/comments?post=133923"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/posts\/133923\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/media\/72293"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/media?parent=133923"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/categories?post=133923"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ai\/wp-json\/wp\/v2\/tags?post=133923"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}