Xie, M. et al. Monolithic 3D integration of 2D transistors and vertical RRAMs in 1T\u20134R structure for high-density memory. Nat. Commun. 14, 5952 (2023).<\/p>\n
Article<\/a>\u00a0 Meng, L. et al. Dual-gated single-molecule field-effect transistors beyond Moore\u2019s law. Nat. Commun. 13, 1410 (2022).<\/p>\n Article<\/a>\u00a0 Li, Q. et al. 3D stacked IGZO 2T0C DRAM array with multibit capability for computing in memory applications. Sci. Adv. 11, eadu4323 (2025).<\/p>\n Article<\/a>\u00a0 Datta, S. et al. Toward attojoule switching energy in logic transistors. Science 378, 733\u2013740 (2022).<\/p>\n Article<\/a>\u00a0 Salahuddin, S. et al. The era of hyper-scaling in electronics. Nat. Electron. 1, 442\u2013450 (2018).<\/p>\n Article<\/a>\u00a0 Shulaker, M. M. et al. Three-dimensional integration of nanotechnologies for computing and data storage on a single chip. Nature 547, 74\u201378 (2017).<\/p>\n Article<\/a>\u00a0 Borsoi, F. et al. Shared control of a 16 semiconductor quantum dot crossbar array. Nat. Nanotechnol. 19, 21\u201327 (2024).<\/p>\n Article<\/a>\u00a0 Gholami, A. et al. AI and memory wall. IEEE Micro 44, 33\u201339 (2024).<\/p>\n Article<\/a>\u00a0 Alloatti, L. et al. 100 GHz silicon-organic hybrid modulator. Light Sci. Appl. 3, e173 (2014).<\/p>\n Article<\/a>\u00a0 Li, K. et al. An integrated CMOS\u2013silicon photonics transmitter with a 112 gigabaud transmission and picojoule per bit energy efficiency. Nat. Electron. 6, 910\u2013921 (2023).<\/p>\n Article<\/a>\u00a0 Hu, Y. et al. III\/V-on-Si MQW lasers by using a novel photonic integration method of regrowth on a bonding template. Light Sci. Appl. 8, 93 (2019).<\/p>\n Article<\/a>\u00a0 Ahmed, S. R. et al. Universal photonic artificial intelligence acceleration. Nature 640, 368\u2013374 (2025).<\/p>\n Article<\/a>\u00a0 Margalit, N. et al. Perspective on the future of silicon photonics and electronics. Appl. Phys. Lett. 118, 220501 (2021).<\/p>\n Article<\/a>\u00a0 Zhang, Y. et al. Scalable 3D silicon photonic electronic integrated circuits and their applications. IEEE J. Sel. Top. Quantum Electron. 26, 1\u201310 (2020).<\/p>\n Zou, K. et al. High-capacity free-space optical communications using wavelength- and mode-division-multiplexing in the mid-infrared region. Nat. Commun. 13, 7662 (2022).<\/p>\n Article<\/a>\u00a0 Kim, C. et al. Robust Co alloy design for Co interconnects using a self-forming barrier layer. Sci. Rep. 12, 12291 (2022).<\/p>\n Article<\/a>\u00a0 Deutsch, A. et al. Frequency-dependent losses on high-performance interconnections. IEEE Trans. Electromagn. Compat. 43, 446\u2013465 (2001).<\/p>\n Article<\/a>\u00a0 Williamson, I. A. D. et al. Suppression of the skin effect in radio frequency transmission lines via gridded conductor fibers. Appl. Phys. Lett. 108, 083502 (2016).<\/p>\n Article<\/a>\u00a0 Wang, T.-Y. et al. Polymeric insulating materials characteristics for high-voltage applications. Nat. Rev. Electr. Eng. 1, 516\u2013528 (2024).<\/p>\n Article<\/a>\u00a0 Wang, W. et al. Rail-only: a low-cost high-performance network for training LLMs with trillion parameters. In 2024 IEEE Symposium on High-Performance Interconnects (HOTI) 1\u201310 (IEEE, 2024).<\/p>\n Tian, W. et al. Progress in research on co-packaged optics. Micromachines 15, 1211 (2024).<\/p>\n Article<\/a>\u00a0 Priyadarshi, S. Advancing AI scalability and performance with optical interconnects. IEEE Commun. Mag. 63, 22\u201327 (2025).<\/p>\n Article<\/a>\u00a0 Fathololoumi, S. 4 Tb\/s optical compute interconnect chiplet for XPU-to-XPU connectivity. In 2024 IEEE Hot Chips 36 Symposium (HCS) 1\u201318 (IEEE, 2024).<\/p>\n Lou, L. et al. From silicon to system: recent advances in wireline transceiver ICs and integration applications for next-generation AI infrastructure. In 2025 IEEE 8th International Conference on Integrated Circuits, Technologies and Applications (ICTA) 151\u2013157 (IEEE, 2025).<\/p>\n Lightmatter announces Passage L200, the fastest co-packaged optics for AI. Lightmatter https:\/\/lightmatter.co\/press-release\/lightmatter-announces-passage-l200-the-fastest-co-packaged-optics-for-ai\/<\/a> (31 March 2025).<\/p>\n Ahmed, K. M. U. et al. A review of data centers energy consumption and reliability modeling. IEEE Access 9, 152536\u2013152563 (2021).<\/p>\n Article<\/a>\u00a0 Ye, B. et al. A 2.29-pJ\/b 112-Gb\/s wireline transceiver with RX four-tap FFE for medium-reach applications in 28-nm CMOS. IEEE J. Solid State Circuits 58, 19\u201329 (2023).<\/p>\n Article<\/a>\u00a0 Das Sharma, D. et al. Universal Chiplet Interconnect Express (UCIe): an open industry standard for innovations with chiplets at package level. IEEE Trans. Compon. Packaging Manuf. Technol. 12, 1423\u20131431 (2022).<\/p>\n Article<\/a>\u00a0 Das, A. et al. Chip and package-scale interconnects for general-purpose, domain-specific, and quantum computing systems\u2014overview, challenges, and opportunities. IEEE J. Emerg. Sel. Top. Circuits Syst. 14, 354\u2013370 (2024).<\/p>\n Article<\/a>\u00a0 Wang, X. et al. Perspectives of active Si photonics devices for data communication and optical sensing. J. Appl. Phys. 138, 060901 (2025).<\/p>\n Article<\/a>\u00a0 Buscaino, B. et al. External vs. integrated light sources for intra-data center co-packaged optical interfaces. J. Lightwave Technol. 39, 1984\u20131996 (2021).<\/p>\n Article<\/a>\u00a0 Tan, M. et al. Co-packaged optics (CPO): status, challenges, and solutions. Front. Optoelectron. 16, 1 (2023).<\/p>\n Article<\/a>\u00a0 Koscica, R. et al. Heterogeneous integration of a III\u2013V quantum dot laser on high thermal conductivity silicon carbide. Opt. Lett. 48, 2539\u20132542 (2023).<\/p>\n Article<\/a>\u00a0 Coenen, D. et al. Thermal scaling analysis of large hybrid laser arrays for co-packaged optics. IEEE J. Sel. Top. Quantum Electron. 31, 1501009 (2025).<\/p>\n Article<\/a>\u00a0 Ghosh, S. et al. Scalable transfer printing approach to heterogeneous integration of InP lasers on silicon-on-insulator waveguide platform. Appl. Phys. Lett. 125, 081104 (2024).<\/p>\n Article<\/a>\u00a0 Hughes, E. T. et al. Gradual degradation in InAs quantum dot lasers on Si and GaAs. Nanoscale 16, 2966\u20132973 (2024).<\/p>\n Article<\/a>\u00a0 Shang, C. et al. High-temperature reliable quantum-dot lasers on Si with misfit and threading dislocation filters. Optica 8, 749\u2013754 (2021).<\/p>\n Article<\/a>\u00a0 Shi, Y. et al. Exploring the feedback limits of quantum dot lasers for isolator-free photonic integrated circuits. Light Sci. Appl. 15, 96 (2026).<\/p>\n Article<\/a>\u00a0 Geler-Kremer, J. et al. A ferroelectric multilevel non-volatile photonic phase shifter. Nat. Photon. 16, 491\u2013497 (2022).<\/p>\n Article<\/a>\u00a0 Chelladurai, D. et al. Barium titanate and lithium niobate permittivity and Pockels coefficients from megahertz to sub-terahertz frequencies. Nat. Mater. 24, 868\u2013875 (2025).<\/p>\n Article<\/a>\u00a0 Reynaud, M. et al. Enhancement of electro-optic response in BaTiO3 films integrated on Si via heating and cooling rate control. Commun. Mater. 6, 176 (2025).<\/p>\n Article<\/a>\u00a0 Xu, Z. et al. Ferroelectric-based Pockels photonic memory. Nat. Commun. 16, 8329 (2025).<\/p>\n Article<\/a>\u00a0 Hu, Y. et al. Integrated electro-optics on thin-film lithium niobate. Nat. Rev. Phys. 7, 237\u2013254 (2025).<\/p>\n Article<\/a>\u00a0 Wang, C. et al. Integrated lithium niobate electro-optic modulators operating at CMOS-compatible voltages. Nature 562, 101\u2013104 (2018).<\/p>\n Article<\/a>\u00a0 Weigel, P. O. et al. Bonded thin film lithium niobate modulator on a silicon photonics platform exceeding 100 GHz 3-dB electrical modulation bandwidth. Opt. Express 26, 23728\u201323739 (2018).<\/p>\n Article<\/a>\u00a0 Eltes, F. et al. A BaTiO3-based electro-optic pockels modulator monolithically integrated on an advanced silicon photonics platform. J. Lightwave Technol. 37, 1456\u20131462 (2019).<\/p>\n Article<\/a>\u00a0 Guo, W. et al. Epitaxial integration of BaTiO3 on Si for electro-optic applications. J. Vac. Sci. Technol. A 39, 030804 (2021).<\/p>\n Article<\/a>\u00a0 Datta, I. et al. Low-loss composite photonic platform based on 2D semiconductor monolayers. Nat. Photon. 14, 256\u2013262 (2020).<\/p>\n Article<\/a>\u00a0 Phare, C. T. et al. Graphene electro-optic modulator with 30 GHz bandwidth. Nat. Photon. 9, 511\u2013514 (2015).<\/p>\n Article<\/a>\u00a0 Michel, J. et al. High-performance Ge-on-Si photodetectors. Nat. Photon. 4, 527\u2013534 (2010).<\/p>\n Article<\/a>\u00a0 Lischke, S. et al. Ultra-fast germanium photodiode with 3-dB bandwidth of 265 GHz. Nat. Photon. 15, 925\u2013931 (2021).<\/p>\n Article<\/a>\u00a0 Sun, W. et al. Ultralow-LO-power silicon photonic coherent receiver with balanced Ge\/Si avalanche photodiodes. ACS Photon. 12, 1793\u20131801 (2025).<\/p>\n Article<\/a>\u00a0 Sun, A. et al. Edge-guided inverse design of digital metamaterial-based mode multiplexers for high-capacity multi-dimensional optical interconnect. Nat. Commun. 16, 2372 (2025).<\/p>\n Article<\/a>\u00a0 Sideris, C. et al. Foundry-fabricated grating coupler demultiplexer inverse-designed via fast integral methods. Commun. Phys. 5, 68 (2022).<\/p>\n Article<\/a>\u00a0 Yang, K. Y. et al. Multi-dimensional data transmission using inverse-designed silicon photonics and microcombs. Nat. Commun. 13, 7862 (2022).<\/p>\n Article<\/a>\u00a0 Zhou, X. et al. Silicon photonics for high-speed communications and photonic signal processing. npj Nanophoton. 1, 27 (2024).<\/p>\n Article<\/a>\u00a0 Komljenovic, T. et al. Heterogeneous silicon photonic integrated circuits. J. Lightwave Technol. 34, 20\u201335 (2016).<\/p>\n Article<\/a>\u00a0 Xu, Y. et al. Methods and applications of on-chip beam splitting: a review. Front. Phys. 10, 985208 (2022).<\/p>\n Article<\/a>\u00a0 Rao, A. et al. Towards integrated photonic interposers for processing octave-spanning microresonator frequency combs. Light Sci. Appl. 10, 109 (2021).<\/p>\n Article<\/a>\u00a0 Zhang, Y. et al. Low-loss and broadband wafer-scale optical interposers for large-scale heterogeneous integration. Opt. Express 32, 40 (2024).<\/p>\n Article<\/a>\u00a0 Liang, D. et al. An energy-efficient and bandwidth-scalable DWDM heterogeneous silicon photonics integration platform. IEEE J. Sel. Top. Quantum Electron. 28, 6100819 (2022).<\/p>\n Article<\/a>\u00a0 Larocque, H. et al. Tunable quantum emitters on large-scale foundry silicon photonics. Nat. Commun. 15, 5781 (2024).<\/p>\n Article<\/a>\u00a0 Zahran, S. R. et al. Bondwire integration challenges in E-band systems: from PCB to die level. In 2023 53rd EuMC 846\u2013849 (IEEE, 2023).<\/p>\n Lau, J. H. Recent advances and trends in chiplet design and heterogeneous integration packaging. J. Electron. Packag. 146, 010801 (2024).<\/p>\n Article<\/a>\u00a0 Mahajan, R. et al. Scaling EMIB\u2014a comprehensive architecture portfolio for localized interconnects. IEEE Trans. Electron Devices 72, 3911\u20133914 (2025).<\/p>\n Article<\/a>\u00a0 Zhao, J. et al. Development of high performance 2.5D packaging using glass interposer with through glass vias. J. Mater. Sci. Mater. Electron. 34, 1790 (2023).<\/p>\n Article<\/a>\u00a0 Mirshafiei, M. et al. Glass interposer for short reach optical connectivity. Opt. Express 24, 12375 (2016).<\/p>\n Article<\/a>\u00a0 Yu, C. et al. Application of through glass via (TGV) technology for sensors manufacturing and packaging. Sensors 24, 171 (2024).<\/p>\n Article<\/a>\u00a0 Ge, C. et al. High-speed wafer-level TGV interposer for 2.5D CPO. Opt. Commun. 579, 131517 (2025).<\/p>\n Article<\/a>\u00a0 Li, X. et al. Die-embedded glass interposer with minimum warpage for 5G\/6G applications. In 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2247\u20132254 (IEEE, 2023).<\/p>\n Yoon, S. et al. Stitching-loss-tolerant silicon nitride waveguides on glass for panel-level optical interconnects. Opt. Lett. 51, 1903 (2026).<\/p>\n Article<\/a>\u00a0 Lee, B. G. et al. Beyond CPO: a motivation and approach for bringing optics onto the silicon interposer. J. Lightwave Technol. 41, 1152\u20131162 (2023).<\/p>\n Article<\/a>\u00a0 Yeary, L. et al. Co-packaged optics on glass substrates for 102.4 Tb\/s data center switches. In 2023 IEEE Electronic Components and Technology Conference (ECTC) 224\u2013227 (IEEE, 2023).<\/p>\n Stojanovic, V. et al. High-density 3D electronic-photonic integration. In 2015 Fourth Berkeley Symposium on Energy Efficient Electronics Systems (E3S) 1\u20132 (IEEE, 2015).<\/p>\n Xiang, C. et al. Building 3D integrated circuits with electronics and photonics. Nat. Electron. 7, 422\u2013424 (2024).<\/p>\n Article<\/a>\u00a0 Chew, S. A. et al. Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch. Nat. Rev. Electr. Eng. 1, 71\u201372 (2024).<\/p>\n Article<\/a>\u00a0 Daudlin, S. et al. Three-dimensional photonic integration for ultra-low-energy, high-bandwidth interchip data links. Nat. Photon. 19, 502\u2013509 (2025).<\/p>\n Article<\/a>\u00a0 You, J. et al. Hybrid\/integrated silicon photonics based on 2D materials in optical communication nanosystems. Laser Photon. Rev. 14, 2000239 (2020).<\/p>\n Article<\/a>\u00a0 Alvarado, A. et al. On the impact of optimal modulation and FEC overhead on future optical networks. J. Lightwave Technol. 34, 2339\u20132352 (2016).<\/p>\n Article<\/a>\u00a0 Lundberg, L. et al. Power consumption of a minimal-DSP coherent link with a polarization multiplexed pilot-tone. In ECOC 2016: 42nd European Conference on Optical Communication 1\u20133 (VDE, 2016).<\/p>\n Wang, R. et al. Heterogeneously integrated III\u2013V-on-silicon 2.3x \u03bcm distributed feedback lasers based on a type-II active region. Appl. Phys. Lett. 109, 221111 (2016).<\/p>\n Article<\/a>\u00a0 Wu, S. et al. Simulation and experimental investigation of liquid-cooling thermal management for high-bandwidth co-packaged optics. Front. Optoelectron. 18, 11 (2025).<\/p>\n Article<\/a>\u00a0 Parsons, R. et al. Highly uniform thermally undercut silicon photonic devices in a 300 mm CMOS foundry process. Sci. Rep. 15, 29906 (2025).<\/p>\n Article<\/a>\u00a0 Chen, X. et al. Improving the thermal reliability of photonic chiplets on multicore processors. Integration 86, 9\u201321 (2022).<\/p>\n Article<\/a>\u00a0 Lin, C. et al. Miniaturized Mg3Bi2-based thermoelectric cooler for localized electronic thermal management. Nat. Commun. 16, 7779 (2025).<\/p>\n Article<\/a>\u00a0 Zhong, Y. et al. Heterogeneous integration of diamond-on-chip-on-glass interposer for efficient thermal management. IEEE Electron Device Lett. 45, 448\u2013451 (2024).<\/p>\n Article<\/a>\u00a0 van Erp, R. et al. Co-designing electronics with microfluidics for more sustainable cooling. Nature 585, 211\u2013216 (2020).<\/p>\n Article<\/a>\u00a0 Li, Y. et al. Transforming heat transfer with thermal metamaterials and devices. Nat. Rev. Mater. 6, 488\u2013507 (2021).<\/p>\n Article<\/a>\u00a0 Yang, S. et al. Nonreciprocal thermal photonics. Nat. Photon. 18, 412\u2013424 (2024).<\/p>\n Article<\/a>\u00a0 Ling, J. et al. Athermal lithium niobate microresonator. Opt. Express 28, 21682 (2020).<\/p>\n Article<\/a>\u00a0 Shekhar, S. et al. Roadmapping the next generation of silicon photonics. Nat. Commun. 15, 751 (2024).<\/p>\n Article<\/a>\u00a0 Heck, M. J. INSPIRE: InP on SiN photonic integrated circuits realized through wafer-scale micro-transfer printing. In Integrated Photonics Platforms II Proc. SPIE 12148 (SPIE, 2022).<\/p>\n Qin, S. et al. Micro-transfer printing of O-band InGaAs\/InP photodiodes on a silicon nitride photonic platform. Opt. Express 33, 34153\u201334169 (2025).<\/p>\n Article<\/a>\u00a0 Ranno, L. et al. Integrated photonics packaging: challenges and opportunities. ACS Photon. 9, 3467\u20133485 (2022).<\/p>\n Article<\/a>\u00a0 Kim, H. et al. Remote epitaxy. Nat. Rev. Methods Primers 2, 41 (2022).<\/p>\n Article<\/a>\u00a0 Meng, Y. et al. Photonic van der Waals integration from 2D materials to 3D nanomembranes. Nat. Rev. Mater. 8, 498\u2013517 (2023).<\/p>\n Article<\/a>\u00a0 Shim, J. et al. Room-temperature waveguide-integrated photodetector using bolometric effect for mid-infrared spectroscopy applications. Light Sci. Appl. 14, 125 (2025).<\/p>\n Article<\/a>\u00a0 Shin, J. et al. Vertical full-colour micro-LEDs via 2D materials-based layer transfer. Nature 614, 81\u201387 (2023).<\/p>\n Article<\/a>\u00a0 Qi, L. et al. Monolithic full-color active-matrix micro-LED micro-display using InGaN\/AlGaInP heterogeneous integration. Light Sci. Appl. 12, 258 (2023).<\/p>\n Article<\/a>\u00a0 Pezeshki, B. et al. 304 channel microLED based CMOS transceiver IC with aggregate 1 Tbps and sub-pJ per bit capability. In Proceedings Optical Fiber Communication Conference (OFC) 2024 Technical Digest Series, Paper M3A.1 (Optica Publishing Group, 2024).<\/p>\n Benyahya, K. et al. MOSAIC: breaking the optics versus copper trade-off with a wide-and-slow architecture and microLEDs. In Proceeding of the ACM SIGCOMM 2025 Conference 234\u2013247 (ACM, 2025).<\/p>\n Farmakidis, N. et al. Integrated photonic neuromorphic computing: opportunities and challenges. Nat. Rev. Electr. Eng. 1, 358\u2013373 (2024).<\/p>\n Article<\/a>\u00a0 Shastri, B. J. et al. Photonics for artificial intelligence and neuromorphic computing. Nat. Photon. 15, 102\u2013114 (2021).<\/p>\n Article<\/a>\u00a0 Bai, B. et al. Microcomb-based integrated photonic processing unit. Nat. Commun. 14, 66 (2023).<\/p>\n Article<\/a>\u00a0 Xiang, C. et al. 3D integration enables ultralow-noise isolator-free lasers in silicon photonics. Nature 620, 78\u201385 (2023).<\/p>\n Article<\/a>\u00a0 Roelkens, G. et al. Present and future of micro-transfer printing for heterogeneous photonic integrated circuits. APL Photon. 9, 010901 (2024).<\/p>\n Article<\/a>\u00a0 Dong, B. et al. Turnkey locking of quantum-dot lasers directly grown on Si. Nat. Photon. 18, 669\u2013676 (2024).<\/p>\n Article<\/a>\u00a0 De Koninck, Y. et al. GaAs nano-ridge laser diodes fully fabricated in a 300-mm CMOS pilot line. Nature 637, 63\u201369 (2025).<\/p>\n Article<\/a>\u00a0 Han, C. et al. Slow-light silicon modulator with 110-GHz bandwidth. Sci. Adv. 9, eadi5339 (2023).<\/p>\n Article<\/a>\u00a0 He, M. et al. High-performance hybrid silicon and lithium niobate Mach\u2013Zehnder modulators for 100 Gbit s\u22121 and beyond. Nat. Photon. 13, 359\u2013364 (2019).<\/p>\n Article<\/a>\u00a0 Eppenberger, M. et al. Resonant plasmonic micro-racetrack modulators with high bandwidth and high temperature tolerance. Nat. Photon. 17, 360\u2013367 (2023).<\/p>\n Article<\/a>\u00a0 Abel, S. et al. Large Pockels effect in micro- and nanostructured barium titanate integrated on silicon. Nat. Mater. 18, 42\u201347 (2019).<\/p>\n Article<\/a>\u00a0 Peng, Y. et al. An 8 \u00d7 160 Gb s\u22121 all-silicon avalanche photodiode chip. Nat. Photon. 18, 928\u2013934 (2024).<\/p>\n Article<\/a>\u00a0 Lee, H. et al. Ultra-low-loss optical delay line on a silicon chip. Nat. Commun. 3, 867 (2012).<\/p>\n Article<\/a>\u00a0 Siew, S. Y. et al. Review of silicon photonics technology and platform development. J. Lightwave Technol. 39, 4374\u20134389 (2021).<\/p>\n Article<\/a>\u00a0 Liu, J. et al. High-yield, wafer-scale fabrication of ultralow-loss, dispersion-engineered silicon nitride photonic circuits. Nat. Commun. 12, 2236 (2021).<\/p>\n Article<\/a>\u00a0 Zhu, X. et al. Low-loss fiber-to-chip edge coupler for silicon nitride integrated circuits. Opt. Express 31, 10525\u201310532 (2023).<\/p>\n Article<\/a>\u00a0 Thomson, D. et al. Roadmap on silicon photonics. J. Opt. 18, 073003 (2016).<\/p>\n Article<\/a>\u00a0 Wang, H. et al. Ultralow-loss optical interconnect enabled by topological unidirectional guided resonance. Sci. Adv. 10, eadn4372 (2024).<\/p>\n Article<\/a>\u00a0 Samanta, A., Lee, S.-H., Cheng, C.-Y., Palermo, S. & Yoo, S. J. B. 3D electronic\u2013photonic heterogeneous interconnect platforms enabling energy-efficient scalable architectures for future HPC systems. IEEE J. Sel. Top. Quantum Electron. 32, 1\u201314 (2026).<\/p>\n Article<\/a>\u00a0 Stojanovic, V. A UCIe optical I\/O retimer chiplet for AI scale-up. In 2025 IEEE Hot Chips 37 Symposium (HCS) 1\u201322 (IEEE, 2025).<\/p>\n Cao, R. et al. Thermomechanical and compression analyses for large-scale co-packaged optics (CPO) assembly. IEEE Trans. Compon. Packaging Manuf. Technol. 14, 2079\u20132087 (2024).<\/p>\n Article<\/a>\u00a0 Winterbottom, P. Photonic interconnect for accelerated computing celestial AI photonic fabric module\u2014the world\u2019s first SoC with in-die optical IO. In 2025 IEEE Hot Chips 37 Symposium (HCS) 1\u201313 (IEEE, 2025).<\/p>\n Nagarajan, R. et al. 2.5 D heterogeneous integration for silicon photonics engines in optical transceivers. IEEE J. Sel. Top. Quantum Electron. 29, 8200209 (2023).<\/p>\n Li, H. Y. et al. The cost study of 300mm through silicon interposer (TSI) with BEOL interconnect. In 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) 664\u2013668 (IEEE, 2013).<\/p>\n Lau, J. H. Current advances and outlooks in hybrid bonding. IEEE Trans. Compon. Packaging Manuf. Technol. 15, 651\u2013681 (2025).<\/p>\n Article<\/a>\u00a0 Atabaki, A. H. et al. Integrating photonics with silicon nanoelectronics for the next generation of systems on a chip. Nature 556, 349\u2013354 (2018).<\/p>\n Article<\/a>\u00a0
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