{"id":28639,"date":"2026-03-09T23:56:09","date_gmt":"2026-03-09T23:56:09","guid":{"rendered":"https:\/\/www.europesays.com\/ch\/28639\/"},"modified":"2026-03-09T23:56:09","modified_gmt":"2026-03-09T23:56:09","slug":"reticle-placements-to-achieve-efficient-nw-topologies-eth-zurich","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/ch\/28639\/","title":{"rendered":"Reticle Placements To Achieve Efficient NW Topologies (ETH Zurich)"},"content":{"rendered":"<p>Researchers from ETH Zurich published the new technical paper \u201cNetwork Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding.\u201d<\/p>\n<p>Abstract<br \/>\u201cTransformer-based large language models are increasingly constrained by data movement as communication bandwidth drops sharply beyond the chip boundary. Wafer-scale integration using wafer-on-wafer hybrid bonding alleviates this limitation by providing ultra-high bandwidth between reticles on bonded wafers. In this paper, we investigate how the physical placement of reticles on wafers influences the achievable network topology and the resulting communication performance. Starting from a 2D mesh-like baseline, we propose four reticle placements (Aligned, Interleaved, Rotated, and Contoured) that improve throughput by up to 250%, reduce latency by up to 36%, and decrease energy per transmitted byte by up to 38%.\u201d<\/p>\n<p>Find the <a href=\"https:\/\/arxiv.org\/abs\/2603.05266\" rel=\"nofollow noopener\" target=\"_blank\">technical paper here<\/a>.\u00a0 March 2026.<\/p>\n<p>Iff, Patrick, Tommaso Bonato, Maciej Besta, Luca Benini, and Torsten Hoefler. \u201cNetwork Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding.\u201d arXiv preprint arXiv:2603.05266 (2026).<\/p>\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"Researchers from ETH Zurich published the new technical paper \u201cNetwork Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding.\u201d&hellip;\n","protected":false},"author":2,"featured_media":28640,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[6],"tags":[17324,3740,17325,17326,17327,17328,17329,17330,51],"class_list":{"0":"post-28639","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-zurich","8":"tag-3d-integration","9":"tag-eth-zurich","10":"tag-hybrid-bonding","11":"tag-interconnects","12":"tag-reticle-placement","13":"tag-ultra-high-bandwidth","14":"tag-wafer-on-wafer-hybrid-bonding","15":"tag-wafer-scale-integration","16":"tag-zurich"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@ch\/116201926509592881","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/posts\/28639","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/comments?post=28639"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/posts\/28639\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/media\/28640"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/media?parent=28639"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/categories?post=28639"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ch\/wp-json\/wp\/v2\/tags?post=28639"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}