Nvidia<\/a>‘s AI accelerators.<\/p>\nThe global rush to build AI data \u200bcenters has fuelled demand for such chips that feed massive amounts of data to AI accelerators for training and running AI models.<\/p>\n
Samsung, the world’s top memory chipmaker, had been slow in responding to the advanced HBM chip market, \u200clagging behind rivals, including \u2060SK Hynix, in supplying previous-generation HBM chips.<\/p>\n
But Samsung aims to narrow the gap with SK Hynix, the dominant leader. \u2060Song Jai-hyuk, chief technology officer for Samsung Electronics’ chip division, touted the performance of its HBM4 chips on Wednesday, saying customer feedback had been “very satisfactory.”<\/p>\n
Samsung \u200bsaid its \u200bHBM4 delivers a consistent processing speed \u200bof 11.7 gigabits-per-second (Gbps), a 22% \u200cincrease from its predecessor, HBM3E. Samsung said its latest chips can achieve the maximum speed of 13Gbps, which helps mitigate growing data bottlenecks.<\/p>\n
Samsung also said it planned to deliver samples for next-generation HBM4E chips in the second half of this year.<\/p>\n
Samsung shares ended up 6.4% on Thursday, while SK \u200cHynix closed up 3.3%.<\/p>\n
RISING COMPETITION<\/p>\n
SK Hynix said \u200bin January that it aims to maintain \u200bits “overwhelming” market share in the \u200bnext-generation HBM4 chips, which are in volume production, as \u200cit faces rising competition from Samsung \u200bElectronics.<\/p>\n
It also added \u200bthat it aimed to achieve the production yields of HBM4 similar to those of current-generation HBM3E chips.<\/p>\n
Micron’s CFO also said it was \u200bin high-volume production of \u200cHBM4 and has commenced customer shipments of HBM4, according to media \u200breports.<\/p>\n
(Reporting by Hyunjoo Jin and Heekyong Yang; Editing by Rashmi \u200bAich, Louise Heavens and Anil D’Silva)<\/p>\n","protected":false},"excerpt":{"rendered":"By Hyunjoo Jin SEOUL, Feb 12 (Reuters) – Samsung Electronics said on Thursday it had started shipping its…\n","protected":false},"author":2,"featured_media":333403,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","_share_on_mastodon":"0"},"categories":[261],"tags":[291,45262,289,290,32128,18,19,17,30725,80704,82],"class_list":["post-333402","post","type-post","status-publish","format-standard","has-post-thumbnail","category-artificial-intelligence","tag-ai","tag-ai-accelerators","tag-artificial-intelligence","tag-artificialintelligence","tag-chips","tag-eire","tag-ie","tag-ireland","tag-samsung-electronics","tag-sk-hynix","tag-technology"],"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@ie\/116057238533196989","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts\/333402","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/comments?post=333402"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts\/333402\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/media\/333403"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/media?parent=333402"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/categories?post=333402"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/tags?post=333402"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}