{"id":483670,"date":"2026-05-14T03:46:16","date_gmt":"2026-05-14T03:46:16","guid":{"rendered":"https:\/\/www.europesays.com\/ie\/483670\/"},"modified":"2026-05-14T03:46:16","modified_gmt":"2026-05-14T03:46:16","slug":"tsmc-says-global-chip-market-to-hit-1-5-trillion-by-2030-as-ai-drives-growth","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/ie\/483670\/","title":{"rendered":"TSMC says global chip market to hit $1.5 trillion by 2030 as AI drives growth"},"content":{"rendered":"\n<p class=\"yf-1fy9kyt\">By Wen-Yee Lee<\/p>\n<p class=\"yf-1fy9kyt\">HSINCHU, Taiwan, May 14 (Reuters) &#8211; TSMC (<a rel=\"nofollow noopener\" class=\"link \" href=\"https:\/\/finance.yahoo.com\/quote\/TSM\/\" data-i13n=\"cpos:1;pos:1\" data-ylk=\"slk:TSM;cpos:1;pos:1;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkPosition&quot;:&quot;1&quot;,&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yPosition&quot;:&quot;1&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;TSM&quot;,&quot;yHasCommerce&quot;:false}\" target=\"_blank\">TSM<\/a>), the world&#8217;s largest contract chipmaker, expects the global semiconductor market to exceed $1.5 trillion by 2030, topping \u200cits previous forecast of $1 trillion, according to its presentation materials ahead of a tech \u200csymposium on Thursday.<\/p>\n<p class=\"yf-1fy9kyt\">Here are the details:<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 AI and high-performance computing are expected to account for 55% of \u200bthe $1.5 trillion market, followed by smartphones with 20%, and automotive applications with 10%, according to TSMC.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 TSMC said it has been expanding capacity at a faster pace in 2025 and 2026 and plans to build nine phases of wafer fabs and advanced packaging facilities \u200cin 2026.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 The chipmaker is \u2060projected to ramp up capacity for its most advanced 2-nanometer and next generation A16 chips, with a compounded annual growth rate (CAGR) of \u206070% from 2026 to 2028.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 TSMC said CAGR of capacity for its advanced packaging CoWoS (Chip on Wafer on Substrate) is forecast at more than 80% from 2022 to 2027. CoWoS is a \u200bkey \u200bchip packaging technology widely used in AI chips \u200bincluding those designed by <a rel=\"nofollow noopener\" class=\"link \" href=\"https:\/\/finance.yahoo.com\/quote\/NVDA\/\" data-i13n=\"cpos:2;pos:1\" data-ylk=\"slk:Nvidia;cpos:2;pos:1;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkPosition&quot;:&quot;2&quot;,&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yPosition&quot;:&quot;1&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;Nvidia&quot;,&quot;yHasCommerce&quot;:false}\" target=\"_blank\">Nvidia<\/a>.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 The \u200ccompany said AI accelerator wafer demand is projected to increase 11-fold from 2022 to 2026.<\/p>\n<p class=\"yf-1fy9kyt\">TSMC&#8217;S GLOBAL FOOTPRINT<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 Arizona: The first fab is already in production. Tool move-in for the second fab is planned for the second half of 2026. Construction of a third fab is underway. Work on a fourth fab and the site&#8217;s first advanced \u200cpackaging facility is expected to begin this year.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 \u200bTSMC anticipates a 1.8-fold year-on-year increase in Arizona output \u200bby 2026, with yields comparable to \u200bthose in Taiwan.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 The chipmaker said it completed the purchase of \u200ca second large parcel of land \u200bin Arizona for future \u200bexpansion.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 Japan: The first fab is currently in volume production for 22-nanometer and 28-nanometer products. Plans for the second fab have been upgraded to 3-nanometer in \u200bresponse to strong demand.<\/p>\n<p class=\"yf-1fy9kyt\">\u2022 Germany: \u200cThe fab is currently under construction and progressing as scheduled. It plans \u200bto provide 28-nanometer and 22-nanometer technologies, followed by 16-nanometer and 12-nanometer technologies.<\/p>\n<p class=\"yf-1fy9kyt\">(Reporting \u200bby Wen-Yee Lee; Editing by Kate Mayberry)<\/p>\n","protected":false},"excerpt":{"rendered":"By Wen-Yee Lee HSINCHU, Taiwan, May 14 (Reuters) &#8211; TSMC (TSM), the world&#8217;s largest contract chipmaker, expects the&hellip;\n","protected":false},"author":2,"featured_media":483671,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[261],"tags":[291,289,290,135058,18,19,17,82,18707],"class_list":{"0":"post-483670","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-artificial-intelligence","8":"tag-ai","9":"tag-artificial-intelligence","10":"tag-artificialintelligence","11":"tag-chipmaker","12":"tag-eire","13":"tag-ie","14":"tag-ireland","15":"tag-technology","16":"tag-tsmc"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@ie\/116570881078331196","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts\/483670","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/comments?post=483670"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/posts\/483670\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/media\/483671"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/media?parent=483670"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/categories?post=483670"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ie\/wp-json\/wp\/v2\/tags?post=483670"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}