IBM Japan<\/a>.<\/p>\nRapidus is focused on developing next-generation logic semiconductors at the 2-nanometer scale, with an objective to begin mass production in the 2027 fiscal year. Earlier this year, the company secured approximately 160 billion yen in combined investment from private firms, alongside a planned 250 billion yen from government sources.<\/p>\n
Interactive table based on the Store Companies dataset for this report.<\/p>\n
\t\t\t\tSort: Rank
\n\t\t\t\tSort: Company A-Z
\n\t\t\t\tSort: Headquarters A-Z<\/p>\n
\t\t\t\t\t#
\n\t\t\t\t\tCompany
\n\t\t\t\t\tHeadquarters
\n\t\t\t\t\tFocus
\n\t\t\t\t\tScale
\n\t\t\t\t\tNote<\/p>\n
\t\t\t\t\t\t1
\n\t\t\t\t\t\tKioxia Holdings Corporation
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tNAND Flash Memory
\n\t\t\t\t\t\tGlobal Leader
\n\t\t\t\t\t\tFormerly Toshiba Memory<\/p>\n
\t\t\t\t\t\t2
\n\t\t\t\t\t\tMicron Memory Japan, Inc.
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tDRAM, NAND
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tSubsidiary of US Micron, HQ in Japan<\/p>\n
\t\t\t\t\t\t3
\n\t\t\t\t\t\tRenesas Electronics Corporation
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tMCU, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded memory, SoC<\/p>\n
\t\t\t\t\t\t4
\n\t\t\t\t\t\tSony Semiconductor Solutions
\n\t\t\t\t\t\tKanagawa
\n\t\t\t\t\t\tImage Sensors, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded memory for sensors<\/p>\n
\t\t\t\t\t\t5
\n\t\t\t\t\t\tRohm Semiconductor
\n\t\t\t\t\t\tKyoto
\n\t\t\t\t\t\tLSI, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded and specialty memory<\/p>\n
\t\t\t\t\t\t6
\n\t\t\t\t\t\tLapis Semiconductor
\n\t\t\t\t\t\tKanagawa
\n\t\t\t\t\t\tLSI, Embedded Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tRohm group, system LSIs<\/p>\n
\t\t\t\t\t\t7
\n\t\t\t\t\t\tMitsubishi Electric
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tPower, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded memory in devices<\/p>\n
\t\t\t\t\t\t8
\n\t\t\t\t\t\tFujitsu Semiconductor
\n\t\t\t\t\t\tKanagawa
\n\t\t\t\t\t\tMCU, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory, SoC<\/p>\n
\t\t\t\t\t\t9
\n\t\t\t\t\t\tEpson Semiconductor
\n\t\t\t\t\t\tNagano
\n\t\t\t\t\t\tMCU, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory for devices<\/p>\n
\t\t\t\t\t\t10
\n\t\t\t\t\t\tSeiko Instruments
\n\t\t\t\t\t\tChiba
\n\t\t\t\t\t\tSemiconductors, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory solutions<\/p>\n
\t\t\t\t\t\t11
\n\t\t\t\t\t\tABLIC Inc.
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tAnalog, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tFormerly SII Semiconductor<\/p>\n
\t\t\t\t\t\t12
\n\t\t\t\t\t\tAsahi Kasei Microdevices
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tAnalog, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory in ICs<\/p>\n
\t\t\t\t\t\t13
\n\t\t\t\t\t\tNuvoton Technology Japan
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tMCU, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory solutions<\/p>\n
\t\t\t\t\t\t14
\n\t\t\t\t\t\tSocionext Inc.
\n\t\t\t\t\t\tKanagawa
\n\t\t\t\t\t\tASIC, SoC, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tCustom SoCs with memory<\/p>\n
\t\t\t\t\t\t15
\n\t\t\t\t\t\tMegaChips Corporation
\n\t\t\t\t\t\tOsaka
\n\t\t\t\t\t\tASIC, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tSystem LSIs with memory<\/p>\n
\t\t\t\t\t\t16
\n\t\t\t\t\t\tAoi Electronics
\n\t\t\t\t\t\tNagano
\n\t\t\t\t\t\tSemiconductor, Memory
\n\t\t\t\t\t\tSmall
\n\t\t\t\t\t\tSpecialty memory products<\/p>\n
\t\t\t\t\t\t17
\n\t\t\t\t\t\tYokogawa Electric
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tControl, Memory ICs
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory in control ICs<\/p>\n
\t\t\t\t\t\t18
\n\t\t\t\t\t\tRicoh Electronic Devices
\n\t\t\t\t\t\tOsaka
\n\t\t\t\t\t\tAnalog, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded memory in power ICs<\/p>\n
\t\t\t\t\t\t19
\n\t\t\t\t\t\tToshiba Electronic Devices
\n\t\t\t\t\t\tKanagawa
\n\t\t\t\t\t\tDiscrete, Memory
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tSystem LSIs with memory<\/p>\n
\t\t\t\t\t\t20
\n\t\t\t\t\t\tNippon Precision Circuits
\n\t\t\t\t\t\tSaitama
\n\t\t\t\t\t\tIC, Memory
\n\t\t\t\t\t\tSmall
\n\t\t\t\t\t\tPart of Seiko Group<\/p>\n
\t\t\t\t\t\t21
\n\t\t\t\t\t\tNisshinbo Micro Devices
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tAnalog, Memory
\n\t\t\t\t\t\tSmall
\n\t\t\t\t\t\tEmbedded memory in ICs<\/p>\n
\t\t\t\t\t\t22
\n\t\t\t\t\t\tShindengen Electric Mfg.
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tPower, Semiconductor
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tICs with embedded memory<\/p>\n
\t\t\t\t\t\t23
\n\t\t\t\t\t\tJRC (Japan Radio Co.)
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tSemiconductor, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tICs for comms, memory<\/p>\n
\t\t\t\t\t\t24
\n\t\t\t\t\t\tFujitsu Frontech
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tSystems, Memory
\n\t\t\t\t\t\tMedium
\n\t\t\t\t\t\tEmbedded system memory<\/p>\n
\t\t\t\t\t\t25
\n\t\t\t\t\t\tHitachi Astemo
\n\t\t\t\t\t\tIbaraki
\n\t\t\t\t\t\tAuto, Semiconductor
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tICs with embedded memory<\/p>\n
\t\t\t\t\t\t26
\n\t\t\t\t\t\tDenso Ten
\n\t\t\t\t\t\tHyogo
\n\t\t\t\t\t\tAuto Electronics, ICs
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded memory in auto ICs<\/p>\n
\t\t\t\t\t\t27
\n\t\t\t\t\t\tAlps Alpine
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tComponents, ICs
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tEmbedded memory in modules<\/p>\n
\t\t\t\t\t\t28
\n\t\t\t\t\t\tMurata Manufacturing
\n\t\t\t\t\t\tKyoto
\n\t\t\t\t\t\tComponents, Modules
\n\t\t\t\t\t\tGlobal Leader
\n\t\t\t\t\t\tModules with memory ICs<\/p>\n
\t\t\t\t\t\t29
\n\t\t\t\t\t\tTDK Corporation
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tComponents, Modules
\n\t\t\t\t\t\tGlobal Leader
\n\t\t\t\t\t\tMemory in embedded modules<\/p>\n
\t\t\t\t\t\t30
\n\t\t\t\t\t\tTaiyo Yuden
\n\t\t\t\t\t\tTokyo
\n\t\t\t\t\t\tComponents, Modules
\n\t\t\t\t\t\tMajor
\n\t\t\t\t\t\tModules with memory ICs<\/p>\n
This report provides a comprehensive view of the memories industry in Japan, tracking demand, supply, and trade flows across the national value chain. It explains how demand across key channels and end-use segments shapes consumption patterns, while also mapping the role of input availability, production efficiency, and regulatory standards on supply.<\/p>\n
Beyond headline metrics, the study benchmarks prices, margins, and trade routes so you can see where value is created and how it moves between domestic suppliers and international partners. The analysis is designed to support strategic planning, market entry, portfolio prioritization, and risk management in the memories landscape in Japan.<\/p>\n
Quick navigation
\nKey findings<\/p>\n
Domestic demand is shaped by both household and industrial usage, with trade flows linking local supply to imports and exports.
\n Pricing dynamics reflect unit values, freight costs, exchange rates, and regulatory shifts that affect sourcing decisions.
\n Supply depends on input availability and production efficiency, creating a distinct national cost curve.
\n Market concentration varies by segment, creating different competitive landscapes and entry barriers.
\n The 2035 outlook highlights where capacity investment and demand growth are most aligned within the country.
\nReport scope<\/p>\n
The report combines market sizing with trade intelligence and price analytics for Japan. It covers both historical performance and the forward outlook to 2035, allowing you to compare cycles, structural shifts, and policy impacts.<\/p>\n
Market size and growth in value and volume terms
\n Consumption structure by end-use segments
\n Production capacity, output, and cost dynamics
\n Trade flows, exporters, importers, and balances
\n Price benchmarks, unit values, and margin signals
\n Competitive context and market entry conditions
\nProduct coverageProdcom 26113023 – Multichip integrated circuits: memoriesProdcom 26113027 – Electronic integrated circuits (excluding multichip circuits): dynamic random-access memories (D-RAMs)Prodcom 26113034 – Electronic integrated circuits (excluding multichip circuits): static random-access memories (S-RAMs), including cache random-access memories (cache-RAMs)Prodcom 26113054 – Electronic integrated circuits (excluding multichip circuits): UV erasable, programmable, read only memories (EPROMs)Prodcom 26113065 – Electronic integrated circuits (excluding multichip circuits): electrically erasable, programmable, read only memories (E.PROMs), including flash E.PROMsProdcom 26113067 – Electronic integrated circuits (excluding multichip circuits): other memoriesCountry coverageCountry profile and benchmarks<\/p>\n
This report provides a consistent view of market size, trade balance, prices, and per-capita indicators for Japan. The profile highlights demand structure and trade position, enabling benchmarking against regional and global peers.<\/p>\n
Methodology<\/p>\n
The analysis is built on a multi-source framework that combines official statistics, trade records, company disclosures, and expert validation. Data are standardized, reconciled, and cross-checked to ensure consistency across time series.<\/p>\n
International trade data (exports, imports, and mirror statistics)
\n National production and consumption statistics
\n Company-level information from financial filings and public releases
\n Price series and unit value benchmarks
\n Analyst review, outlier checks, and time-series validation<\/p>\n
All data are normalized to a common product definition and mapped to a consistent set of codes. This ensures that comparisons across time are aligned and actionable.<\/p>\n
Forecasts to 2035<\/p>\n
The forecast horizon extends to 2035 and is based on a structured model that links memories demand and supply to macroeconomic indicators, trade patterns, and sector-specific drivers. The model captures both cyclical and structural factors and reflects known policy and technology shifts in Japan.<\/p>\n
Historical baseline: 2012-2025
\n Forecast horizon: 2026-2035
\n Scenario-based sensitivity to income growth, substitution, and regulation
\n Capacity and investment outlook for major producing companies<\/p>\n
Each projection is built from national historical patterns and the broader regional context, allowing the report to show where growth is concentrated and where risks are elevated.<\/p>\n
Price analysis and trade dynamics<\/p>\n
Prices are analyzed in detail, including export and import unit values, regional spreads, and changes in trade costs. The report highlights how seasonality, freight rates, exchange rates, and supply disruptions influence pricing and margins.<\/p>\n
Price benchmarks by country and sub-region
\n Export and import unit value trends
\n Seasonality and calendar effects in trade flows
\n Price outlook to 2035 under baseline assumptions
\nProfiles of market participants<\/p>\n
Key producers, exporters, and distributors are profiled with a focus on their operational scale, geographic footprint, product mix, and market positioning. This helps identify competitive pressure points, partnership opportunities, and routes to differentiation.<\/p>\n
Business focus and production capabilities
\n Geographic reach and distribution networks
\n Cost structure and pricing strategy indicators
\n Compliance, certification, and sustainability context
\nHow to use this report<\/p>\n
Quantify domestic demand and identify the most attractive segments
\n Evaluate export opportunities and prioritize target destinations
\n Track price dynamics and protect margins
\n Benchmark performance against leading competitors
\n Build evidence-based forecasts for investment decisions<\/p>\n
This report is designed for manufacturers, distributors, importers, wholesalers, investors, and advisors who need a clear, data-driven picture of memories dynamics in Japan.<\/p>\n
FAQ
\nWhat is included in the memories market in Japan?<\/p>\n
The market size aggregates consumption and trade data, presented in both value and volume terms.<\/p>\n
How are the forecasts to 2035 built?<\/p>\n
The projections combine historical trends with macroeconomic indicators, trade dynamics, and sector-specific drivers.<\/p>\n
Does the report cover prices and margins?<\/p>\n
Yes, it includes export and import unit values, regional spreads, and a pricing outlook to 2035.<\/p>\n
Which benchmarks are included?<\/p>\n
The report benchmarks market size, trade balance, prices, and per-capita indicators for Japan.<\/p>\n
Can this report support market entry decisions?<\/p>\n
Yes, it highlights demand hotspots, trade routes, pricing trends, and competitive context.<\/p>\n
\t\t\t\t\t\t1. INTRODUCTION<\/p>\n
Report Scope and Analytical Framing<\/p>\n
Report DescriptionResearch Methodology and the Analytical FrameworkData-Driven Decisions for Your BusinessGlossary and Product-Specific Terms2. EXECUTIVE SUMMARY<\/p>\n
Concise View of Market Direction<\/p>\n
Key FindingsMarket TrendsStrategic ImplicationsKey Risks and Watchpoints3. DOMESTIC MARKET SIZE AND DEVELOPMENT PATH<\/p>\n
Market Size, Growth and Scenario Framing<\/p>\n
Market Size: Historical Data (2012-2025) and Forecast (2026-2035)Growth Outlook and Market Development Path to 2035Growth Driver DecompositionScenario Framework and Sensitivities4. CATEGORY SCOPE, DEFINITIONS AND BOUNDARIES<\/p>\n
Commercial and Technical Scope<\/p>\n
What Is Included and How the Market Is DefinedMarket Inclusion CriteriaProduct \/ Category DefinitionExclusions and BoundariesDistinction From Adjacent Products and Substitute Categories5. CATEGORY STRUCTURE, SEGMENTATION AND PRODUCT MATRIX<\/p>\n
How the Market Splits Into Decision-Relevant Buckets<\/p>\n
By Product Type \/ ConfigurationBy Application \/ End UseBy Customer \/ Buyer TypeBy Channel \/ Business Model \/ Technology PlatformSegment Attractiveness MatrixProduct Matrix and Segment Growth Logic6. DOMESTIC DEMAND, CUSTOMER AND BUYER ARCHITECTURE<\/p>\n
Where Demand Comes From and How It Behaves<\/p>\n
Consumption \/ Demand: Historical Data (2012-2025) and Forecast (2026-2035)Demand by End-Use and Buyer GroupDemand by Customer \/ Consumer SegmentPurchase Criteria, Switching Logic and Adoption BarriersReplacement, Replenishment and Installed-Base DynamicsFuture Demand Outlook7. DOMESTIC PRODUCTION, SUPPLY AND VALUE CHAIN<\/p>\n
Supply Footprint and Value Capture<\/p>\n
Production in the CountryDomestic Manufacturing FootprintCapacity, Bottlenecks and Supply RisksValue Chain Logic and Margin PoolsDistribution and Route-to-Market Structure8. IMPORTS, EXPORTS AND SOURCING STRUCTURE<\/p>\n
Trade Flows and External Dependence<\/p>\n
ExportsImportsTrade BalanceImport DependenceSourcing Risks and Resilience9. PRICING, PROMOTION AND COMMERCIAL MODEL<\/p>\n
Price Formation and Revenue Logic<\/p>\n
Domestic Price Levels and CorridorsPricing by Segment \/ Specification \/ ChannelCost Drivers and Margin LogicPromotion, Discounting and Procurement PatternsRevenue Quality and Commercial Levers10. COMPETITIVE LANDSCAPE AND PORTFOLIO POWER<\/p>\n
Who Wins and Why<\/p>\n
Market Structure and ConcentrationCompetitive ArchetypesSegment-by-Segment Competitive IntensityPortfolio Breadth and Product PositioningCapability MatrixStrategic Moves, Partnerships and Expansion Signals11. DOMESTIC MARKET STRUCTURE AND CHANNEL LOGIC<\/p>\n
How the Domestic Market Works<\/p>\n
Core Demand CentersLocal Production and Distribution RolesChannel StructureBuyer and Procurement ArchitectureRegional Imbalances Within the Country12. GROWTH PLAYBOOK AND MARKET ENTRY<\/p>\n
Commercial Entry and Scaling Priorities<\/p>\n
Where to PlayHow to WinDistributor \/ Partner \/ Direct Entry OptionsCapability ThresholdsEntry Risks and Mitigation13. WHERE TO PLAY NEXT: MOST ATTRACTIVE GROWTH OPPORTUNITIES<\/p>\n
Where the Best Expansion Logic Sits<\/p>\n
Most Attractive Product NichesMost Attractive Customer SegmentsWhite Spaces and Unsaturated OpportunitiesHigh-Margin and Underpenetrated PocketsMost Promising Product Adjacencies14. PROFILES OF MAJOR COMPANIES<\/p>\n
Leading Players and Strategic Archetypes<\/p>\n
Leading Manufacturers and SuppliersProduction Footprint and CapacitiesProduct Portfolio and Segment FocusPricing Positioning and Indicative Price LogicChannel \/ Distribution StrengthStrategic Archetypes15. METHODOLOGY, SOURCES AND DISCLAIMER<\/p>\n
How the Report Was Built<\/p>\n
Modeling LogicSource RegisterPublications, Regulatory and Industry ReferencesAnalytical NotesDisclaimer\t\t\t\t\t<\/p>\n
Loading News content from Store report…<\/p>\n
\t\t\t\t\t\t\t\t\t\t\t\t\tKioxia Holdings Corporation<\/p>\n
Formerly Toshiba Memory<\/p>\n
Micron Memory Japan, Inc.<\/p>\n
Subsidiary of US Micron, HQ in Japan<\/p>\n
Renesas Electronics Corporation<\/p>\n
Embedded memory, SoC<\/p>\n
Sony Semiconductor Solutions<\/p>\n
Embedded memory for sensors<\/p>\n
Rohm Semiconductor<\/p>\n
Embedded and specialty memory<\/p>\n
Lapis Semiconductor<\/p>\n
Rohm group, system LSIs<\/p>\n
Mitsubishi Electric<\/p>\n
Embedded memory in devices<\/p>\n
Fujitsu Semiconductor<\/p>\n
Embedded memory, SoC<\/p>\n
Epson Semiconductor<\/p>\n
Embedded memory for devices<\/p>\n
Seiko Instruments<\/p>\n
Embedded memory solutions<\/p>\n
ABLIC Inc.<\/p>\n
Formerly SII Semiconductor<\/p>\n
Asahi Kasei Microdevices<\/p>\n
Embedded memory in ICs<\/p>\n
Nuvoton Technology Japan<\/p>\n
Embedded memory solutions<\/p>\n
Socionext Inc.<\/p>\n
Custom SoCs with memory<\/p>\n
MegaChips Corporation<\/p>\n
System LSIs with memory<\/p>\n
Aoi Electronics<\/p>\n
Specialty memory products<\/p>\n
Yokogawa Electric<\/p>\n
Embedded memory in control ICs<\/p>\n
Ricoh Electronic Devices<\/p>\n
Embedded memory in power ICs<\/p>\n
Toshiba Electronic Devices<\/p>\n
System LSIs with memory<\/p>\n
Nippon Precision Circuits<\/p>\n
Part of Seiko Group<\/p>\n
Nisshinbo Micro Devices<\/p>\n
Embedded memory in ICs<\/p>\n
Shindengen Electric Mfg.<\/p>\n
ICs with embedded memory<\/p>\n
JRC (Japan Radio Co.)<\/p>\n
ICs for comms, memory<\/p>\n
Fujitsu Frontech<\/p>\n
Embedded system memory<\/p>\n
Hitachi Astemo<\/p>\n
ICs with embedded memory<\/p>\n
Denso Ten<\/p>\n
Embedded memory in auto ICs<\/p>\n
Alps Alpine<\/p>\n
Embedded memory in modules<\/p>\n
Murata Manufacturing<\/p>\n
Modules with memory ICs<\/p>\n
TDK Corporation<\/p>\n
Memory in embedded modules<\/p>\n
Taiyo Yuden<\/p>\n
Modules with memory ICs<\/p>\n
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Loading Macro Indicators content from Store report…<\/p>\n","protected":false},"excerpt":{"rendered":"Apr 12, 2026 Japan’s industry ministry has approved an additional 631.5 billion yen to accelerate research and development…\n","protected":false},"author":2,"featured_media":3881,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[2],"tags":[3766,3768,1733,3767,8,3769,33,1882,3770,2122,1957],"class_list":{"0":"post-3880","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-japan","8":"tag-2-nanometer","9":"tag-chipmaker","10":"tag-fujitsu","11":"tag-ibm","12":"tag-japan","13":"tag-mass-production","14":"tag-nihon","15":"tag-rapidus","16":"tag-research-and-development","17":"tag-semiconductors","18":"tag-supply-chains"},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/posts\/3880","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/comments?post=3880"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/posts\/3880\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/media\/3881"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/media?parent=3880"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/categories?post=3880"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/japan\/wp-json\/wp\/v2\/tags?post=3880"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}