Conceptual diagram of the iHBM solution unveiled by SK hynix. SK hynix
SK hynix (000660.KS) has unveiled a next-generation high-bandwidth memory (HBM) solution that structurally addresses heat dissipation, the biggest challenge in artificial intelligence (AI) semiconductors. The breakthrough approach inserts a “cooling block” inside the package, even at the cost of sacrificing part of the HBM die area. The move comes as heat control has emerged as a key performance metric in the AI chip market.
SK hynix on Wednesday unveiled its next-generation “iHBM” technology, which embeds an integrated cooling component called ICE (Integrated Cooling Elements) inside the HBM package to dramatically reduce heat density.
The core of iHBM lies in its structural innovation. Conventional HBM has used an indirect method that releases heat generated during operation through the upper core (memory) die to the outside. In contrast, iHBM allocates part of the area of the “die-to-die physical layer (D2D PHY)” region on top of the base (logic) die — the most severe hotspot — and places ICE, made of high thermal conductivity silicon material, on top of it. This can lower thermal resistance by more than 30% compared with existing HBM.
ICE is similar to the method of controlling heat by placing a Heat Path Block (HPB) on top of a computing unit. Samsung Electronics also adopted similar HPB technology in its mobile processor (AP) “Exynos 2600.”
The iHBM technology maintains mass-production reliability while changing the hardware structure. SK hynix’s proprietary advanced packaging process technology, “Mass Reflow Molded Underfill (MR-MUF),” is applied as is, allowing the company to maintain a stable mass-production system.
Compatibility on the customer side has also been maximized. The technology is designed to maintain the existing system-in-package (SiP) environment that combines with graphics processing units (GPUs) and systems-on-chip (SoCs). Big tech customers such as Nvidia can immediately adopt iHBM in next-generation systems without major separate design changes. This significantly reduces the cost and time burden of adoption. SK hynix plans to apply iHBM technology in earnest starting from the next-generation seventh-generation HBM (HBM5).
“iHBM is the optimal heat control solution derived by combining our memory design capabilities with advanced packaging technology,” said Lee Kang-wook, vice president in charge of package (PKG) development at SK hynix. “We will proactively provide practical value that customers need in the AI environment and solidify our global AI memory leadership.”