{"id":102801,"date":"2026-07-29T09:03:05","date_gmt":"2026-07-29T09:03:05","guid":{"rendered":"https:\/\/www.europesays.com\/korea\/102801\/"},"modified":"2026-07-29T09:03:05","modified_gmt":"2026-07-29T09:03:05","slug":"samsung-broadcom-partner-with-200bn-ai-semiconductor-mou","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/korea\/102801\/","title":{"rendered":"Samsung, Broadcom partner with $200bn AI semiconductor MoU"},"content":{"rendered":"<p>Samsung Electronics has signed an Memorandum of Understanding (MoU) with Broadcom to work more closely on next-generation semiconductor technologies.<\/p>\n<p>The agreement, which was signed at the AI Summit in San Francisco is expected to be worth over $200 billion across memory and foundry technologies over the next five years, through to 2030.<\/p>\n<p class=\"has-text-align-center\">Looking for more Middle East &amp; Africa coverage? Subscribe to our separate Email Newsletter, sent every other Wednesday \u2013<a href=\"https:\/\/www.mobileeurope.co.uk\/subscribe-mea\/\" rel=\"nofollow noopener\" target=\"_blank\"> click here to sign up.<\/a><\/p>\n<p>As a result, the partnership will see the telecoms giant supply Broadcom with advanced memory products, including High Bandwidth Memory (HBM), which has become a key component in powering increasingly complex AI systems. <\/p>\n<p>Alongside this, the companies will also work together on Samsung\u2019s cutting-edge 2-nanometre (2nm) manufacturing process, as well as advanced chip packaging technologies designed to deliver faster, more power-efficient <a href=\"https:\/\/www.mobileeurope.co.uk\/category\/content-categories\/automation-ai\/\" rel=\"nofollow noopener\" target=\"_blank\">AI<\/a> and networking chips.<\/p>\n<p>According to the company, the move reflects growing pressures on chipmakers to deliver more powerful hardware as <a href=\"https:\/\/www.mobileeurope.co.uk\/category\/content-categories\/automation-ai\/\" rel=\"nofollow noopener\" target=\"_blank\">AI adoption<\/a> accelerates across industries. <\/p>\n<p>Beyond memory, the partnership will focus on manufacturing Broadcom\u2019s products, including Wireless Broadband Communications (WBC) solutions, using <a href=\"https:\/\/www.mobileeurope.co.uk\/?s=Samsung\" rel=\"nofollow noopener\" target=\"_blank\">Samsung<\/a>\u2018s latest semiconductor processes. <\/p>\n<p>The companies also plan to develop advanced 2.3D and 2.5D packaging technologies that allow multiple chips to be combined into a single, high-performance package, helping improve both speed and energy efficiency.<\/p>\n<p>Samsung Electronics Vice Chairman &amp; CEO of the Device Solutions (DS) Division, Young Hyun Jun, said: \u201cAI is driving unprecedented demand for tightly integrated semiconductor technologies spanning memory, logic and advanced packaging.<\/p>\n<p>\u201cBy expanding our collaboration with Broadcom across these critical technologies, we look forward to delivering greater value to customers while advancing the AI infrastructure of the future.\u201d<\/p>\n<p>Broadcom President of Semiconductor Solutions Group, Charlie Kawwas, said: \u201cAs AI infrastructure continues to scale, close collaboration across the semiconductor ecosystem becomes increasingly important.<\/p>\n<p>\u201cBy combining Samsung\u2019s memory and foundry expertise with Broadcom\u2019s AI and connectivity leadership, we aim to continue to deliver technologies that power the next generation of AI infrastructure.\u201d<\/p>\n<p>IN RELATED NEWS<\/p>\n","protected":false},"excerpt":{"rendered":"Samsung Electronics has signed an Memorandum of Understanding (MoU) with Broadcom to work more closely on next-generation semiconductor&hellip;\n","protected":false},"author":2,"featured_media":102802,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[18],"tags":[1137,24012,257,127,276],"class_list":["post-102801","post","type-post","status-publish","format-standard","has-post-thumbnail","category-samsung-electronics","tag-ai","tag-broadcom","tag-mou","tag-samsung","tag-samsung-electronics"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/102801","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=102801"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/102801\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/102802"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=102801"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=102801"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=102801"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}