![\"Samsung](\"https:\/\/www.europesays.com\/korea\/wp-content\/uploads\/2026\/08\/news-p.v1.20260805.e66c034e22164deb9bb06b277ea427d5_P1.jpg\"\/ "\\"Samsung,")
Samsung Electronics’ CXL Memory Module (CMM-D) product. Photo courtesy of Samsung Electronics<\/p>\nSamsung Electronics’ CXL Memory Module (CMM-D) product. Photo courtesy of Samsung Electronics<\/p>\n
Samsung Electronics (005930.KS) and SK hynix (000660.KS) are accelerating development of next-generation semiconductor technologies beyond high-bandwidth memory (HBM), including processing-in-memory (PIM), which integrates memory and computing functions, and compute express link (CXL), which dramatically boosts memory connection speeds. Companies in the US, China and Japan, including Micron, are also in pursuit with proprietary technologies aimed at reshaping the HBM paradigm.<\/p>\n
According to the industry on the 5th, Samsung Electronics unveiled its “low-power double data rate (LPDDR)5X-processing-in-memory (PIM),” the first in the industry, at “Future of Memory and Storage (FMS) 2026” on the 4th. PIM is a next-generation chip that embeds a small computing unit in DRAM, enabling it not only to store but also to perform computations on its own. LPDDR5X-PIM is a product that applies this to the latest low-power DRAM.<\/p>\n
Samsung Electronics, which had previously disclosed the technology in academic circles, is understood to have announced the technology’s completion through this event and entered a full-fledged sales phase to attract Big Tech customers. It will introduce the LPDDR5X-PIM in detail at “Hot Chips,” a global academic conference to be held in the US on the 23rd of next month (local time).<\/p>\n
SK hynix is also preparing to compete, having unveiled various PIM prototypes such as AiMX, CuD and CMM-Ax to Big Tech companies at “Consumer Electronics Show (CES) 2026” earlier this year. Micron of the US said it is “researching PIM architecture.”<\/p>\n
Another battleground among the three memory makers is CXL memory. Micron put CXL front and center at “FMS 2026.” The company emphasized that applying its CXL memory to AI systems improved computing performance five to 10 times over previous levels. Samsung Electronics is preparing for mass production of memory based on the latest CXL 3.2 version within the year, and SK hynix recently unveiled a memory sample of the same class, with Micron now joining the competition in earnest. CXL is drawing attention as a new solution as surging AI data makes it difficult to cope with HBM capacity alone.<\/p>\n
At this year’s FMS, Samsung Electronics unveiled z-NAND and SK hynix unveiled high-bandwidth flash (HBF), while Japan’s Kioxia countered with its new SSD product, the “GP1 series.” The company explained that by applying its proprietary “XL Flash” technology, it can directly assist GPU computation without going through HBM.<\/p>\n
Intel, the pride of the US, recently filed a patent for its cross-batch memory (XBM) technology. The concept is to eliminate the “silicon interposer,” the device that connects HBM to the graphics processing unit (GPU), and apply a simpler connection method to lower technical difficulty and boost efficiency. Qualcomm plans to release an AI chip equipped with high-bandwidth compute (HBC), which it unveiled in late June, as early as the end of this year. Similar to Samsung’s zHBM, it vertically connects DRAM and the GPU.<\/p>\n
China’s CXMT is closely pursuing Samsung Electronics and SK hynix in the next-generation DRAM competition, with the possibility emerging that it will mass-produce LPDDR6 in the second half of this year. TSMC plans to commercialize “COUPE,” a silicon photonics (optical semiconductor) manufacturing and packaging platform, in cooperation with Big Tech companies in the second half.<\/p>\n","protected":false},"excerpt":{"rendered":"Samsung Electronics’ CXL Memory Module (CMM-D) product. Photo courtesy of Samsung Electronics Samsung Electronics (005930.KS) and SK hynix…\n","protected":false},"author":2,"featured_media":109817,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[18],"tags":[40141,699,3916,1485,27161,56461,43340,127,276,275],"class_list":["post-109816","post","type-post","status-publish","format-standard","has-post-thumbnail","category-samsung-electronics","tag-cxl","tag-hbm","tag-lpddr5x","tag-micron","tag-next-generation-memory","tag-pim","tag-processing-in-memory","tag-samsung","tag-samsung-electronics","tag-sk-hynix"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/109816","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=109816"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/109816\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/109817"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=109816"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=109816"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=109816"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}