South Korea’s LG Chem (051910.KS) announced on the 26th that it will participate in SEMICON Taiwan 2026, Asia’s largest semiconductor exhibition, to unveil a broad portfolio of advanced packaging material solutions for artificial intelligence (AI) semiconductors.<\/p>\n
The exhibition will be held from September 2 to 4 at the Taipei Nangang Exhibition Center in Taiwan. As Asia’s largest event showcasing next-generation semiconductor technology trends including advanced packaging and AI semiconductors, it serves as a venue where key global industry players\u2014including semiconductor manufacturers, outsourced semiconductor assembly and test (OSAT) companies, and substrate and packaging firms\u2014gather to discuss technology exchange and business collaboration.<\/p>\n
LG Chem will set up a booth (No. S7430) on the 4th floor of TaiNEX 2 at the Nangang Exhibition Center, showcasing advanced packaging materials for AI semiconductors including High Bandwidth Memory (HBM), as well as power semiconductor material solutions.<\/p>\n
In the “Advanced Package Zone,” which introduces advanced packaging materials for AI semiconductors, the company will exhibit a range of materials applied in advanced packaging processes, including copper clad laminate (CCL), glass core solutions, buildup film, film-type solder resist (DFSR), photosensitive insulating material (PID), die attach film (DAF), bonding and debonding solutions, and fine-process strippers.<\/p>\n
In the “Power Package Zone,” LG Chem will unveil conductive sintering paste (Ag\/Cu), thermal interface materials (TIM), and thermal management device solutions based on copper metal foam. These materials are regarded as key components that contribute to semiconductor performance enhancement through improved efficiency and thermal management of power semiconductors for AI data centers.<\/p>\n
LG Chem plans to use this exhibition as an opportunity to expand collaboration with major semiconductor manufacturers, OSAT companies, and substrate and packaging firms. Through technology exchange and the identification of new projects, the company aims to broaden its customer base in the AI semiconductor and advanced packaging markets and accelerate growth in its semiconductor materials business.<\/p>\n
Kim Dong-chun, CEO of LG Chem, said, “As the AI semiconductor and advanced packaging markets expand, customer demand for high-performance materials is increasing. LG Chem will expand collaboration with semiconductor customers based on its differentiated material portfolio and actively secure growth opportunities in the future semiconductor market.”<\/p>\n
Given Taiwan’s significant share of the global semiconductor supply chain, this exhibition is expected to provide LG Chem with an opportunity to expand its engagement with major Taiwanese semiconductor companies including Taiwan Semiconductor Manufacturing (TSMC). Notably, amid surging demand for HBM and advanced packaging, the company has put the competitiveness of next-generation substrate materials such as glass core and copper clad laminate at the forefront.<\/p>\n
LG Chem is shifting its portfolio away from its traditional petrochemical-centric business structure toward high-value-added areas such as battery materials and semiconductor materials. This participation in SEMICON Taiwan is part of the company’s global expansion strategy for its semiconductor materials business, with new customer acquisition and project wins expected to be key variables for business growth going forward.<\/p>\n","protected":false},"excerpt":{"rendered":"South Korea’s LG Chem (051910.KS) announced on the 26th that it will participate in SEMICON Taiwan 2026, Asia’s…\n","protected":false},"author":2,"featured_media":132184,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[25],"tags":[541,9917,2587,21008,315,10336,314,30975,29500,67334,67378],"class_list":["post-132183","post","type-post","status-publish","format-standard","has-post-thumbnail","category-lg","tag-copper-clad-laminate","tag-glass-core","tag-high-bandwidth-memory","tag-kim-dong-chun","tag-lg","tag-lg-chem","tag-lg-group","tag-osat","tag-power-semiconductors","tag-semicon-taiwan-2026","tag-taipei-nangang-exhibition-center"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/132183","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=132183"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/132183\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/132184"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=132183"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=132183"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=132183"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}