{"id":17101,"date":"2026-05-14T20:01:01","date_gmt":"2026-05-14T20:01:01","guid":{"rendered":"https:\/\/www.europesays.com\/korea\/17101\/"},"modified":"2026-05-14T20:01:01","modified_gmt":"2026-05-14T20:01:01","slug":"intel-sk-hynix-shares-surge-following-reports-of-chip-packaging-partnership-sk-is-said-to-be-testing-intels-2-5d-emib-for-hbm-integration-2","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/korea\/17101\/","title":{"rendered":"Intel, SK hynix shares surge following reports of chip packaging partnership \u2014 SK is said to be testing Intel&#8217;s 2.5D EMIB for HBM integration"},"content":{"rendered":"\n<p class=\"yf-1fy9kyt\">When you buy through links on our articles, Future and its syndication partners may earn a commission.<\/p>\n<p class=\"yf-1fy9kyt\">Share prices of both Intel and SK hynix have surged following a <a href=\"https:\/\/zdnet.co.kr\/view\/?no=20260511105848\" rel=\"nofollow noopener\" target=\"_blank\" data-ylk=\"slk:ZDNet Korea;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;ZDNet Korea&quot;}\" class=\"link \">ZDNet Korea<\/a> report claiming that SK is conducting R&amp;D with Intel on 2.5D packaging using Intel&#8217;s Embedded Multi-die Interconnect Bridge (EMIB) technology, with the intention of integrating high-bandwidth memory (HBM) and logic semiconductors. Citing unnamed industry sources, ZDNet Korea reports that the company is also evaluating the materials and components required for production.<\/p>\n<p class=\"yf-1fy9kyt\">Go deeper with TH Premium: Memory<\/p>\n<p>    <img fetchpriority=\"high\" decoding=\"async\" src=\"https:\/\/www.europesays.com\/korea\/wp-content\/uploads\/2026\/05\/a0f2ae97c827ecfd6be0b62d839755a7.png\" alt=\"HBM3E vs HBM4\" loading=\"eager\" height=\"540\" width=\"960\" class=\"yf-lglytj  loaded\"\/> HBM3E vs HBM4         <\/p>\n<p class=\"yf-1fy9kyt\">SK hynix shares have hit an all-time intraday high of $1,320 (1,946,000 Korean Won) on the Korea Exchange, climbing as much as 14.5% and pushing the company&#8217;s market cap past $900 billion. Likewise, Intel&#8217;s share price is up nearly 14% at the time of publication, marking a rise of 229% in the last six months, and 91% in the last month alone.<\/p>\n<p class=\"yf-1fy9kyt\">EMIB connects multiple semiconductor dies using small silicon bridges embedded directly in the package substrate, rather than relying on the large silicon interposer that underpins TSMC&#8217;s Chip-on-Wafer-on-Substrate (CoWoS) platform. The approach is less expensive per package and avoids some of CoWoS&#8217;s thermal complexity, though the two technologies target different segments of the market.<\/p>\n<p class=\"yf-1fy9kyt\">Intel Foundry has been actively marketing EMIB and its next-gen variant, EMIB-T, to external customers. Intel CFO Dave Zinsner told the Morgan Stanley TMT conference in March that the foundry division is &#8220;close to closing some deals that are in the billions per year in terms of revenue&#8221; on advanced packaging alone. EMIB-T, which adds through-silicon vias to the bridge for HBM4 compatibility and higher bandwidth, is expected to <a href=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/intels-emib-t-heads-for-fab-rollout-this-year\" rel=\"nofollow noopener\" target=\"_blank\" data-ylk=\"slk:enter production fab rollout this year;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;enter production fab rollout this year&quot;}\" class=\"link \">enter production fab rollout this year<\/a>.<\/p>\n<p class=\"yf-1fy9kyt\">TSMC&#8217;s CoWoS lines, meanwhile, have been <a href=\"https:\/\/www.tomshardware.com\/tech-industry\/semiconductors\/intel-gains-ground-in-ai-packaging-as-cowos-capacity-remains-stretched\" rel=\"nofollow noopener\" target=\"_blank\" data-ylk=\"slk:massively oversubscribed;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;massively oversubscribed&quot;}\" class=\"link \">massively oversubscribed<\/a> for more than two years. Nvidia alone is expected to account for roughly 60% of global CoWoS demand this year, with Broadcom and AMD absorbing another 26%. That leaves limited capacity for custom ASIC vendors and smaller AI chip developers, creating an opening for alternative packaging providers.<\/p>\n<p class=\"yf-1fy9kyt\">Intel has already confirmed that some customer designs originally scoped for CoWoS have been ported to EMIB or Foveros, <a href=\"https:\/\/finance.yahoo.com\/sectors\/technology\/articles\/intel-reportedly-talks-google-amazon-102000081.html\" data-ylk=\"slk:with reports last month;elm:context_link;itc:0;sec:content-canvas;outcm:mb_qualified_link;_E:mb_qualified_link;ct:story;\" data-yga=\"{&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;with reports last month&quot;}\" class=\"link  yahoo-link\" rel=\"nofollow noopener\" target=\"_blank\">with reports last month<\/a> that Google and Amazon are among the hyperscalers showing interest in Intel Foundry&#8217;s advanced packaging capabilities, no doubt at least driven in part by limited access to CoWoS.<\/p>\n<p class=\"yf-1fy9kyt\">SK hynix is already building its own 2.5D packaging facilities independently of Intel. The company recently broke ground on a <a href=\"https:\/\/www.tomshardware.com\/tech-industry\/sk-hynix-to-build-first-us-2-5d-packaging-plant-for-hbm\" rel=\"nofollow noopener\" target=\"_blank\" data-ylk=\"slk:$3.87 billion advanced packaging plant;elm:context_link;itc:0;sec:content-canvas\" data-yga=\"{&quot;yLinkElement&quot;:&quot;context_link&quot;,&quot;yModuleName&quot;:&quot;content-canvas&quot;,&quot;yLinkText&quot;:&quot;$3.87 billion advanced packaging plant&quot;}\" class=\"link \">$3.87 billion advanced packaging plant<\/a> in West Lafayette, Indiana, which is expected to begin operations in 2028, and approved a \u20a919 trillion ($12.9 billion) packaging and test facility in Cheongju, South Korea, in January. If the Intel EMIB partnership materializes, it would give SK hynix an additional packaging pathway alongside its own in-house facilities and its longstanding reliance on TSMC&#8217;s CoWoS.<\/p>\n<p class=\"yf-1fy9kyt\">Neither SK nor Intel has confirmed the rumors.<\/p>\n","protected":false},"excerpt":{"rendered":"When you buy through links on our articles, Future and its syndication partners may earn a commission. Share&hellip;\n","protected":false},"author":2,"featured_media":17102,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[23],"tags":[12293,2653,337,7800,241,240,275],"class_list":["post-17101","post","type-post","status-publish","format-standard","has-post-thumbnail","category-sk","tag-emib","tag-intel","tag-korea-exchange","tag-packaging","tag-sk","tag-sk-group","tag-sk-hynix"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/17101","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=17101"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/17101\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/17102"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=17101"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=17101"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=17101"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}