{"id":47871,"date":"2026-06-10T06:01:07","date_gmt":"2026-06-10T06:01:07","guid":{"rendered":"https:\/\/www.europesays.com\/korea\/47871\/"},"modified":"2026-06-10T06:01:07","modified_gmt":"2026-06-10T06:01:07","slug":"samsung-electronics-considers-building-chip-packaging-plant-report","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/korea\/47871\/","title":{"rendered":"Samsung Electronics considers building chip packaging plant: Report"},"content":{"rendered":"<p><a href=\"https:\/\/economictimes.indiatimes.com\/topic\/samsung-electronics\" target=\"_blank\" rel=\"nofollow noopener\">Samsung Electronics<\/a> is considering the construction of an advanced <a href=\"https:\/\/economictimes.indiatimes.com\/topic\/semiconductor-packaging\" target=\"_blank\" rel=\"nofollow noopener\">semiconductor packaging<\/a> facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily said on Tuesday.<\/p>\n<p>Here are some details:<\/p>\n<p>Samsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country&#8217;s largest conglomerates on June \u200c29, the \u2060newspaper reported, \u2060citing unnamed industry sources.<\/p>\n<p>The meeting, to be held at the presidential office under the theme \u200bof a &#8220;major shift in growth strategy,&#8221; is expected to include Samsung Electronics Chairman Jay Y. \u200bLee and SK Group Chairman Chey Tae-won.<\/p>\n<p>Separately, SK Hynix is also considering building a new chip packaging production facility in the southwestern region, particularly in South \u200bJeolla Province, daily newspaper Dong-a reported on Wednesday.<\/p>\n<p>Samsung \u2060Electronics and \u200cSK Hynix declined to comment. The presidential office said corporate \u200binvestment decisions \u200bare matters for companies to determine.<\/p>\n<p>The move would mark \u2060one of Samsung&#8217;s latest efforts to strengthen its advanced chip packaging capabilities, a critical part of the <a href=\"https:\/\/economictimes.indiatimes.com\/topic\/ai-chip-supply-chain\" target=\"_blank\" rel=\"nofollow noopener\">AI chip supply chain<\/a> as demand surges for high-bandwidth memory chips used in AI servers.<\/p>\n<p>The Korea Economic Daily said that Samsung&#8217;s investment would be seen as a sign that the company is seeking to accelerate spending ahead of what many expect to be an upswing in the chip sector driven by AI demand.<\/p>\n<p>Advanced \u200cpackaging has become increasingly important as chipmakers seek to improve performance by integrating multiple chips into a single package. Demand has been \u200bparticularly strong for \u200bHBM, which stacks multiple \u2060DRAM chips vertically and is used alongside AI processors from companies such as Nvidia.<\/p>\n<p>Samsung&#8217;s customers include major AI players such as Nvidia , AMD and Google, which \u200bare driving demand for advanced memory chips used in AI servers and processors.<\/p>\n<p>Samsung has been expanding its presence in the HBM market as it seeks to challenge market leader SK Hynix. In May, the company said it had begun shipping samples of its latest HBM chip, the 12-layer HBM4E, to customers.<\/p>\n","protected":false},"excerpt":{"rendered":"Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city&hellip;\n","protected":false},"author":2,"featured_media":47872,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[18],"tags":[24672,27707,27706,127,276,27702],"class_list":["post-47871","post","type-post","status-publish","format-standard","has-post-thumbnail","category-samsung-electronics","tag-advanced-packaging","tag-ai-chip-supply-chain","tag-high-bandwidth-memory-hbm","tag-samsung","tag-samsung-electronics","tag-semiconductor-packaging"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/47871","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=47871"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/47871\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/47872"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=47871"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=47871"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=47871"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}