Join ADI Macnica Power Tech Day to gain valuable insights! <\/a> <\/p>\nAI infrastructure and physical AI are pushing the industry into advanced node and 3D\u2011IC designs that demand far more capacity, integration and signoff confidence than ever before.<\/p>\n
\u201cWith this next phase of our Samsung Foundry collaboration, we\u2019re giving joint customers a production\u2011proven platform to deliver the next-generation of AI and HPC systems to market faster,\u201d said Boyd Phelps, senior vice president and general manager of the Silicon Solutions Group at Cadence.<\/p>\n
Samsung Foundry said demand for advanced AI designs is driving adoption of its second-generation 2nm technology.<\/p>\n
\u201cCustomers are increasingly drawn to Samsung Foundry\u2019s second-generation 2nm for leading\u2011edge AI designs that must keep pace with the exploding demand across AI infrastructure and emerging physical AI applications,\u201d said Jongshin Shin, executive vice president and head of Foundry Design Platform Development at Samsung Electronics. \u201cOur expanded Cadence partnership delivers a robust semiconductor and 3D-IC platform with advanced Memory, Interface IP and AI-optimized flows for superior performance, efficiency and innovation.\u201d<\/p>\n
The certified flow on second-generation 2nm includes Cadence Innovus for digital implementation, Virtuoso Studio for analog and custom design, Integrity 3D\u2011IC Platform for system planning and implementation, Voltus IC Power Integrity Solution for power analysis, and Quantus Extraction and Tempus Timing for signoff.<\/p>\n
Cadence said the flow supports advanced 2nm design features including glitch power optimization and smart hierarchical implementation to improve performance, power, area, and turnaround time.<\/p>\n
For Samsung\u2019s 3D Cube-H technology, the companies are enabling a full planning, implementation, and signoff flow for hybrid copper bonding. The flow includes Cerebrus Intelligent Chip Explorer, Integrity 3D\u2011IC, Innovus, Voltus, and Pegasus Verification System, along with silicon interposer auto-routing and optimization.<\/p>\n
NVIDIA is using the expanded Cadence-Samsung platform for high-bandwidth interconnect and accelerated computing designs.<\/p>\n
\u201cAs AI workloads scale and system architectures grow more demanding, the semiconductor ecosystem depends on tools and platforms that can keep pace with simulation and design complexity at advanced nodes,\u201d said Timothy Costa, vice president and general manager of computational engineering at NVIDIA. \u201cBy leveraging Cadence\u2019s GPU-accelerated design flows on Samsung Foundry\u2019s second-generation 2nm platform, we\u2019re optimizing the performance and delivery of next-generation AI architectures and high-bandwidth interconnects.\u201d<\/p>\n
Ambarella is also developing a next-generation 2nm edge AI platform using the companies\u2019 PCIe 5.0 IP and design flows for robotics, drones, autonomous systems, and advanced sensing applications.<\/p>\n
\u201cOur collaboration with Cadence and Samsung Foundry to deliver IP for PCIe 5.0 for our next\u2011generation 2nm edge AI platform has been critical as we address the design, verification and manufacturing complexity of this node,\u201d said Chan Lee, chief operating officer at Ambarella. \u201cHaving a signoff\u2011ready, co\u2011optimized IP and tools solution, together with a robust, production\u2011proven design kit and PDK, enables our teams to move forward with confidence, reduce risk and stay focused on accelerating innovation in low\u2011power AI perception, physical AI and intelligent edge computing.\u201d<\/p>\n","protected":false},"excerpt":{"rendered":"Cadence Design Systems Inc. and Samsung Foundry expanded their multi-year collaboration focused on second-generation 2nm process technology and…\n","protected":false},"author":2,"featured_media":51128,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[18],"tags":[25922,127,276,8752],"class_list":["post-51127","post","type-post","status-publish","format-standard","has-post-thumbnail","category-samsung-electronics","tag-cadence","tag-samsung","tag-samsung-electronics","tag-samsung-foundry"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/51127","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=51127"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/51127\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/51128"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=51127"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=51127"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=51127"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}