{"id":93112,"date":"2026-07-21T02:37:18","date_gmt":"2026-07-21T02:37:18","guid":{"rendered":"https:\/\/www.europesays.com\/korea\/93112\/"},"modified":"2026-07-21T02:37:18","modified_gmt":"2026-07-21T02:37:18","slug":"sk-group-chairman-warns-memory-chip-prices-are-abnormally-high-plans-u-s-plant-to-curb-chipflation-biggo-finance","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/korea\/93112\/","title":{"rendered":"SK Group Chairman Warns Memory Chip Prices Are &#8220;Abnormally High,&#8221; Plans U.S. Plant to Curb &#8220;Chipflation&#8221; \u2014 BigGo Finance"},"content":{"rendered":"<p>Global memory chip prices continue to surge, stirring deep concern among industry giants. SK Group Chairman Chey Tae-won, the de facto leader of SK Hynix, issued a rare and stark warning at a press conference, stating that current memory chip prices have reached &#8220;abnormally high&#8221; levels. Left unchecked, he cautioned, this will not only trigger &#8220;chipflation&#8221; that batters the consumer electronics market but could also spawn geopolitical risks. He made clear that the company must pursue aggressive capacity expansion to stabilize prices, even at the expense of near-term profits, and for the first time detailed a strategic blueprint for building a plant in the U.S. to address trade pressures.<\/p>\n<p>&#8220;Memory chip prices are abnormally high right now,&#8221; Chey said bluntly. He dissected the destructive ripple effects of inflated prices across the supply chain. AI companies, with their strong fundraising capabilities and return-on-investment expectations, can still absorb the cost surge from upstream chips, but personal computer (PC) and smartphone manufacturers are in a difficult position. These firms, he noted, have no choice but to pass the entire burden of chip price hikes onto end-consumer retail prices, yet ordinary consumers have very limited tolerance for price increases. If this one-way cost transmission mechanism breaks, the entire consumer electronics ecosystem will fall into distress.<\/p>\n<p>&#8220;To avoid &#8216;chipflation&#8217; \u2014 a vicious cycle where rising chip costs drive up overall device costs and end-market prices \u2014 the industry must increase supply,&#8221; Chey emphasized, adding that this is no longer just a matter of commercial profit but of market health. He warned that if major memory chip manufacturers refrain from decisively building new production lines and allow prices to remain elevated, short-term windfall profits will ultimately backfire on the industry itself. The market will continuously shrink under high-price suppression, while supernormal industry profits will act like a magnet, attracting waves of new competitors to enter at any cost and disrupt the existing landscape. He specifically noted that tech leaders like Tesla CEO Elon Musk are crossing into semiconductor manufacturing precisely because current industry profits are staggering.<\/p>\n<p>Chey expressed deep concern over potential geopolitical shocks. He warned that the &#8220;chipflation&#8221; triggered by persistently soaring chip prices is by no means an isolated economic phenomenon \u2014 it will spawn a series of intractable geopolitical conflicts and trade frictions. &#8220;You can&#8217;t just focus on short-term gains and eat all the apples at once,&#8221; he said, using a vivid metaphor. &#8220;You need to cultivate the market, achieve long-term stable development, and ensure you can keep harvesting.&#8221;<\/p>\n<p>While lamenting the dangers of high prices and stressing the necessity of expansion, Chey offered a seemingly contradictory near-term forecast: chip prices are unlikely to materially decline in the short term. His reasoning rests on an unprecedented demand explosion coupled with severely lagging supply. He predicted AI chip demand could surge 60% to 100% next year, yet actual capacity additions from leading memory manufacturers remain minimal. AI-related demand already accounts for more than half of the overall semiconductor market, with total industry demand growth reaching at least 50% to 60%.<\/p>\n<p>&#8220;Next year, no company will undertake large-scale capacity expansion. The industry supply-demand situation is severe \u2014 one could even say chaotic,&#8221; Chey described. He revealed that SK Hynix is under immense pressure from all sides globally, including urgent demands and various forms of pressure from downstream customers, and he anticipates the South Korean government will also likely face political pressure from overseas parties going forward.<\/p>\n<p>It is precisely under this triple squeeze of &#8220;high prices, shortages, and geopolitical risk&#8221; that Chey for the first time systematically laid out SK Hynix&#8217;s global capacity expansion blueprint, particularly the core rationale for building a plant in the U.S. &#8220;This is why, in addition to laying out production lines in the Honam region, we are also considering building a plant in the U.S. \u2014 if conditions permit, it must happen. We need to account for various trade frictions and industry challenges, so we are evaluating overseas plant construction plans.&#8221; He disclosed that the team is screening potential sites globally, mapping all feasible locations, and comparing construction conditions, speed, and capacity scale across regions, with the goal of selecting the best option for rapid execution.<\/p>\n<p>Notably, SK Hynix is currently advancing four mega-projects simultaneously, with investment scale and construction speed that are historically unprecedented.<\/p>\n<p>Overview of SK Hynix&#8217;s Four Projects Under Construction<\/p>\n<p>Project NameInvestment ScaleCore Positioning &amp; ObjectivesKey Timeline MilestonesYongin Semiconductor Cluster600 trillion won (approximately $420 billion)Build a global AI memory production base with 4 fabsOriginally slated for 2045 completion, accelerated to 2033; first fab completion pulled forward to May 2027Cheongju Base100 trillion won (approximately $70 billion)New NAND fab; strengthen HBM back-end advanced packaging capabilitiesNext-gen advanced packaging plant (P&amp;T7) investment of ~19 trillion won (approximately $13.3 billion), expected completion by end of 2027Southwestern New Cluster400 trillion won (approximately $280 billion)Build memory front-end process cluster in Gwangju and South Jeolla ProvinceSite not yet finalized; preparatory work to begin immediatelyU.S. Purdue University Campus Plantapproximately $3.87 billionFocus on HBM advanced packaging; first onshore U.S. facilityGroundbreaking in 2024, expected to begin operations in 2028<\/p>\n<p>In South Korea, the Yongin Semiconductor Cluster is the top priority, with a total investment of 600 trillion won (approximately $420 billion), aimed at becoming a global production base for AI memory chips. The cluster originally planned to complete four fabs by 2045 but has now been ordered to accelerate the entire timeline by 12 years, targeting completion by 2033. Among them, the first fab&#8217;s completion date has been dramatically pulled forward to May 2027. Full-scale construction of the first fab began in February 2025, with the main structure largely completed.<\/p>\n<p>The Cheongju base carries the future of NAND flash and HBM advanced packaging, with an investment scale of 100 trillion won (approximately $70 billion). The P&amp;T7 plant, focused on next-generation advanced packaging technology, involves an investment of approximately 19 trillion won (approximately $13.3 billion) and is expected to be completed by the end of 2027 to meet increasingly complex HBM packaging demands. Additionally, a new southwestern cluster is being planned with an estimated investment of 400 trillion won (approximately $280 billion), which will establish a new memory chip front-end process cluster in the Gwangju and South Jeolla Province area. While the specific site has not been determined, preparatory work has begun immediately.<\/p>\n<p>Overseas, the plant at Purdue University&#8217;s campus in the U.S. represents a critical piece of SK Hynix&#8217;s geopolitical strategy. The facility broke ground in 2024 with an investment of approximately $3.87 billion, focusing on advanced HBM packaging, and is expected to begin operations in 2028. This marks SK Hynix&#8217;s first onshore manufacturing facility in the U.S. and is widely interpreted as a key move to align with the U.S. and mitigate trade risks amid the restructuring of global semiconductor supply chains.<\/p>\n<p>Chey&#8217;s latest remarks bring the structural contradictions of the memory chip industry to the forefront. On one side is the demand tsunami unleashed by the AI wave; on the other is the cautious pace of capacity expansion controlled by leading players in an oligopolistic market. When SK Hynix, the world&#8217;s second-largest memory chip maker, steps forward to announce it will actively suppress prices by accelerating global capacity expansion \u2014 citing the need to &#8220;avoid chipflation&#8221; and &#8220;maintain long-term market health&#8221; \u2014 the cyclical logic of the entire semiconductor industry may be entering a new phase. The ultimate outcome depends not only on the execution speed of SK Hynix&#8217;s four mega-projects but also on whether other major competitors will follow suit in this &#8220;supply-side self-revolution&#8221; initiated by an industry leader.<\/p>\n","protected":false},"excerpt":{"rendered":"Global memory chip prices continue to surge, stirring deep concern among industry giants. SK Group Chairman Chey Tae-won,&hellip;\n","protected":false},"author":2,"featured_media":93113,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[23],"tags":[3988,48887,2589,699,3990,19075,241,240,275,2693],"class_list":["post-93112","post","type-post","status-publish","format-standard","has-post-thumbnail","category-sk","tag-ai-chips","tag-cheongju-base","tag-chey-tae-won","tag-hbm","tag-memory-chips","tag-purdue-university","tag-sk","tag-sk-group","tag-sk-hynix","tag-yongin-semiconductor-cluster"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/93112","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=93112"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/93112\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/93113"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=93112"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=93112"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=93112"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}