Samsung Electronics (005930) has entered into a massive strategic partnership with Broadcom, a leading U.S. AI semiconductor design firm, valued at $200 billion (approximately 292.4 trillion won) over five years. The collaboration is significant because it extends beyond memory chip supply to encompass a “one-stop turnkey solution” that integrates cutting-edge foundry (contract chip manufacturing) and advanced packaging.<\/p>\n
Samsung Electronics announced on the 24th (local time) that it had signed a strategic memorandum of understanding (MOU) with Broadcom to build next-generation AI core infrastructure at the “AI Summit” held at The Midway in San Francisco. The signing ceremony was attended by key executives from both companies, including Han Jin-man, President of Samsung Electronics’ Foundry Business, and Broadcom CEO Hock Tan.<\/p>\n
The two companies agreed to pursue strategic cooperation worth more than $200 billion in the memory and foundry sectors by 2030. This is an unusually large-scale contract for an MOU with a single company, finalized amid the rapid expansion of custom AI accelerator (ASIC) adoption, particularly among global Big Tech firms.<\/p>\n
Full-Spectrum Collaboration ‘From Design to Mass Production’<\/p>\n
The core of this partnership lies in combining Broadcom’s leadership in custom semiconductor design with Samsung Electronics’ strengths in memory, manufacturing, and packaging technology. Samsung plans to actively leverage its position as the world’s only integrated device manufacturer (IDM) capable of independently handling memory, logic (foundry), and advanced packaging.<\/p>\n
In the memory sector, Samsung Electronics will supply state-of-the-art memory solutions, including high-bandwidth memory (HBM), for Broadcom’s next-generation AI accelerators. Samsung has already secured HBM technology leadership, having become the industry’s first to mass-produce and ship 6th-generation HBM4\u2014featuring 1c DRAM and 4-nanometer (nm) base die technology\u2014in February, followed by the industry’s first shipment of 7th-generation HBM4E samples to customers in May.<\/p>\n
In the foundry sector, Samsung’s most advanced processes at 2nm and below will be applied to Broadcom’s key product lineup, including communication semiconductor solutions supporting next-generation high-speed data transmission. Samsung also plans to provide advanced packaging technology based on the 2nm process as a complete package, supporting the realization of high-performance, high-efficiency AI semiconductors.<\/p>\n
A Samsung Electronics official explained, “We will closely link the entire process, from the stage of co-optimizing semiconductor design and process, to chip design, advanced packaging, and mass production. This will help shorten product development timelines and maximize performance and power efficiency.”<\/p>\n
AI Chip Production Likely at Pyeongtaek<\/p>\n
Broadcom’s next-generation AI chips are widely expected to be produced at Samsung Electronics’ Pyeongtaek Campus, the company’s most advanced foundry manufacturing hub. Broadcom is a leading fabless company that designs AI custom semiconductors (ASICs) for global Big Tech firms like Google, and has participated in the development of Google’s AI chip, the TPU. These chips require HBM as an essential component.<\/p>\n
With this agreement, Samsung Electronics gains momentum in its foundry business by securing another major AI semiconductor customer in Broadcom, following NVIDIA. Samsung previously signed an MOU with AMD in March to expand cooperation in next-generation AI memory, including HBM4.<\/p>\n
Jun Young-hyun, Vice Chairman and Head of Samsung Electronics’ Device Solutions (DS) Division, emphasized, “In the AI era, semiconductor solutions that tightly integrate memory, logic, and advanced packaging are the core competitive edge. We will expand our collaboration with Broadcom to accelerate the development of future AI infrastructure and deliver greater value to customers.”<\/p>\n
Charlie Kawwas, President of Broadcom’s Semiconductor Solutions Group, responded, “As AI infrastructure expands rapidly, close collaboration across the entire semiconductor ecosystem is becoming increasingly important. Through our partnership with Samsung Electronics, we will work together to create next-generation solutions optimized for the diversifying demands of the market.”<\/p>\n
Executive Chairman Lee Jae-yong: ‘Building a Perfect Ecosystem’<\/p>\n
Samsung Electronics Executive Chairman Lee Jae-yong attended the main AI Summit event and stressed the importance of global cooperation to lead the AI era. “The AI era cannot be opened by the power of any single company or country alone,” Lee said. “Building a perfect ecosystem\u2014from innovative AI models and cutting-edge semiconductors to data centers for stable services and abundant power\u2014requires global collaboration that transcends borders.”<\/p>\n
He added, “The United States possesses the world’s best AI source technologies, platforms, and outstanding talent, while South Korea has unrivaled competitiveness in semiconductors, devices, and advanced manufacturing. If we combine the strengths of both countries, we can innovate faster, grow bigger, and solve many difficult challenges.”<\/p>\n
This agreement between Samsung Electronics and Broadcom is viewed as a symbolic case demonstrating the rapidly increasing value of “integrated solutions” in the global AI semiconductor market. As the performance of AI accelerators becomes more sophisticated, the tight integration of memory, logic, and packaging technologies becomes essential. Samsung Electronics plans to use this agreement as a springboard to actively explore new business opportunities in the fast-growing AI and high-performance computing market.<\/p>\n","protected":false},"excerpt":{"rendered":"Samsung Electronics (005930) has entered into a massive strategic partnership with Broadcom, a leading U.S. AI semiconductor design…\n","protected":false},"author":2,"featured_media":98337,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[18],"tags":[50979,10844,39516,24012,699,50978,12741,1133,640,127,276],"class_list":["post-98336","post","type-post","status-publish","format-standard","has-post-thumbnail","category-samsung-electronics","tag-2-nanometer-foundry","tag-ai-accelerator","tag-asic","tag-broadcom","tag-hbm","tag-hock-tan","tag-jun-young-hyun","tag-lee-jae-yong","tag-pyeongtaek-campus","tag-samsung","tag-samsung-electronics"],"_links":{"self":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/98336","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/comments?post=98336"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/posts\/98336\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media\/98337"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/media?parent=98336"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/categories?post=98336"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/korea\/wp-json\/wp\/v2\/tags?post=98336"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}