Jaunievedums pusvad\u012bt\u0101ju ra\u017eo\u0161an\u0101: ASV startaps Substrate sola 2 nm \u010dipus 10x l\u0113t\u0101k<\/p>\n
Amerik\u0101\u0146u tehnolo\u0123iju uz\u0146\u0113mums Substrate ir non\u0101cis uzman\u012bbas centr\u0101 ar savu ambicio\u0161o m\u0113r\u0137i \u2014 radik\u0101li main\u012bt mikrosh\u0113mu ra\u017eo\u0161anas industriju. Vi\u0146u izstr\u0101d\u0101t\u0101 jaun\u0101 rentgenstaru litogr\u0101fijas (XRL) sist\u0113ma, kas izmanto pa\u0101trin\u0101tu da\u013ci\u0146u avotu, tiek pozicion\u0113ta k\u0101 revol\u016bcija, kas sp\u0113j nodro\u0161in\u0101t 2 nanometru (nm) tehnolo\u0123isk\u0101 procesa l\u012bme\u0146a \u010dipu ra\u017eo\u0161anu par desmit reiz\u0113m zem\u0101ku izmaksu nek\u0101 pa\u0161reiz\u0113j\u0101s metodes. Potenci\u0101li \u0161\u012b tehnolo\u0123ija var\u0113tu k\u013c\u016bt pieejama jau l\u012bdz 2030. gadam, atverot durvis v\u0113l smalk\u0101ku strukt\u016bru veido\u0161anai n\u0101kotn\u0113.<\/p>\n
K\u0101 darbojas Substrate tehnolo\u0123ija?<\/p>\n
Substrate pieeja balst\u0101s uz unik\u0101lu da\u013ci\u0146u pa\u0101trin\u0101t\u0101ju, kas sasniedz elektronu \u0101trumu, kas tuvojas gaismas \u0101trumam. \u0160ie elektroni, izbraucot caur magn\u0113tiskiem laukiem, emit\u0113 \u013coti intens\u012bvus rentgenstarus \u2014 aprakst\u012bts k\u0101 \u201emiljardiem rei\u017eu spo\u017e\u0101ki par Sauli\u201d. \u0160ie starojuma avoti p\u0113c tam tiek prec\u012bzi fokus\u0113ti ar speci\u0101li izstr\u0101d\u0101tu spogu\u013cu sist\u0113mu, kuras virsma ir neiedom\u0101jami gluda. Rezult\u0101t\u0101 tiek projic\u0113ts att\u0113ls uz sil\u012bcija pl\u0101ksnes, kas p\u0101rkl\u0101ta ar \u012bpa\u0161u, gaismjut\u012bgu materi\u0101lu. Interesanti, ka \u0161\u012b sist\u0113ma teor\u0113tiski var\u0113tu darboties pat bez tradicion\u0101laj\u0101m fotomask\u0101m, izmantojot tie\u0161\u0101s rakst\u012b\u0161anas re\u017e\u012bmu. Lai gan \u0161\u012b pieeja ir ide\u0101li piem\u0113rota zin\u0101tniskajiem p\u0113t\u012bjumiem, t\u0101 pa\u0161laik ir p\u0101r\u0101k l\u0113na masveida ra\u017eo\u0161anai.<\/p>\n
Potenci\u0101ls un izaicin\u0101jumi<\/p>\n
Izmantojot rentgena starojumu ar vi\u013c\u0146a garumu diapazon\u0101 no 1 l\u012bdz 10 nm, Substrate sp\u0113j veidot \u0101rk\u0101rt\u012bgi smalkas strukt\u016bras. Tom\u0113r \u0161is process prasa specifiskus apst\u0101k\u013cus: absol\u016btu vakuuma vidi, \u012bpa\u0161i prec\u012bzus spogu\u013cus un jauna tipa gaismjut\u012bgus materi\u0101lus, kas sp\u0113tu iztur\u0113t sp\u0113c\u012bgo starojumu. Lai demonstr\u0113tu savu progresu, Substrate ir veiksm\u012bgi izveidojis lo\u0123isko kontaktu mas\u012bvu ar kritiskajiem izm\u0113riem 12 nm un att\u0101lumu starp tiem tikai 13 nm. Tas iev\u0113rojami p\u0101rsniedz m\u016bsdienu EUV (Extreme Ultraviolet) litogr\u0101fijas iek\u0101rtu, piem\u0113ram, ASML skeneru, sp\u0113jas, kas pa\u0161laik sp\u0113j druk\u0101t strukt\u016bras ar izm\u0113riem no 13-16 nm. Turkl\u0101t paraugi demonstr\u0113 izcilu l\u012bniju precizit\u0101ti un \u013coti zemu malu raupjumu \u2014 maz\u0101ku par 1 nm. Ja \u0161ie rezult\u0101ti tiks apstiprin\u0101ti, Substrate XRL tehnolo\u0123ija var\u0113tu p\u0101rsp\u0113t pat visjaun\u0101kos ASML mode\u013cus, atst\u0101jot tiem priek\u0161roc\u012bbu vien\u012bgi sl\u0101\u0146u prec\u012bz\u0101 uzkl\u0101\u0161an\u0101.<\/p>\n
Ce\u013c\u0161 uz r\u016bpniecisko ra\u017eo\u0161anu<\/p>\n
\u0160\u012b inovat\u012bv\u0101 pieeja var\u0113tu aizst\u0101t d\u0101rg\u0101s un sare\u017e\u0123\u012bt\u0101s EUV ra\u017eo\u0161anas metodes, ko pa\u0161laik izmanto t\u0101di giganti k\u0101 TSMC un Samsung. Ta\u010du ce\u013c\u0101 uz \u0161\u012bs tehnolo\u0123ijas pilnv\u0113rt\u012bgu ievie\u0161anu st\u0101v vair\u0101ki nopietni \u0161\u0137\u0113r\u0161\u013ci. Galven\u0101 probl\u0113ma ir nesavienojam\u012bba ar eso\u0161aj\u0101m ra\u017eo\u0161anas iek\u0101rt\u0101m. Substrate b\u016bs spiesta veidot piln\u012bgi jaunu pieg\u0101des \u0137\u0113di, s\u0101kot no fotomateri\u0101liem l\u012bdz spogu\u013ciem un mask\u0101m, kas v\u0113l nav pieejami masveida ra\u017eo\u0161an\u0101. Papildus tam, uz\u0146\u0113mumam j\u0101garant\u0113 starojuma stabilit\u0101te, optikas precizit\u0101te, augsta ra\u017eo\u0161anas jauda un sil\u012bcija pl\u0101ksn\u012b\u0161u nesaboj\u0101\u0161ana.<\/p>\n
Biznesa modelis un n\u0101kotnes v\u012bzija<\/p>\n
Substrate nepl\u0101no p\u0101rdot savas XRL sist\u0113mas cit\u0101m firm\u0101m. T\u0101 viet\u0101 uz\u0146\u0113muma strat\u0113\u0123ija paredz savu ra\u017eot\u0146u izveidi ASV, iek\u0101rtu uzst\u0101d\u012b\u0161anu un pied\u0101v\u0101jot \u010dipu ra\u017eo\u0161anas pakalpojumus p\u0113c pas\u016bt\u012bjuma. Tom\u0113r pat vienas \u0161\u0101da l\u012bme\u0146a ra\u017eotnes izveide prasa desmitiem miljardu dol\u0101ru invest\u012bcijas un r\u016bp\u012bgi saska\u0146otu darbu ar simtiem pieg\u0101d\u0101t\u0101ju. Tas padara projektu \u0101rk\u0101rt\u012bgi sare\u017e\u0123\u012btu un d\u0101rgu, pat ja pamattehnolo\u0123ija ir patiesa.<\/p>\n
ASV un Eiropas tehnolo\u0123isk\u0101 sp\u0113ko\u0161an\u0101s<\/p>\n
Substrate amb\u012bcija ir p\u0101rveidot pusvad\u012bt\u0101ju tirgu, radot alternat\u012bvu n\u012bderlandie\u0161u ASML un atjaunojot ASV tehnolo\u0123isko priek\u0161roc\u012bbu. Ja uz\u0146\u0113mumam izdosies ieviest rentgenstaru litogr\u0101fiju r\u016bpniecisk\u0101 m\u0113rog\u0101, tas b\u016btu liel\u0101kais pagrieziena punkts mikrosh\u0113mu ra\u017eo\u0161anas industrij\u0101 kop\u0161 EUV tehnolo\u0123ijas par\u0101d\u012b\u0161an\u0101s. Tom\u0113r l\u012bdz tam v\u0113l ir t\u0101ls ce\u013c\u0161, kas saist\u012bts ar gadiem ilgu\u0161iem p\u0113t\u012bjumiem, miljardu invest\u012bcij\u0101m un nep\u0101rtrauktu c\u012b\u0146u par tirgus uztic\u012bbu.<\/p>\n","protected":false},"excerpt":{"rendered":"Jaunievedums pusvad\u012bt\u0101ju ra\u017eo\u0161an\u0101: ASV startaps Substrate sola 2 nm \u010dipus 10x l\u0113t\u0101k Amerik\u0101\u0146u tehnolo\u0123iju uz\u0146\u0113mums Substrate ir non\u0101cis…\n","protected":false},"author":2,"featured_media":37106,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[19],"tags":[10876,8917,89,90,35,39,38,36,37,34,40,10875,10874,10873],"class_list":{"0":"post-37105","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-izklaide","8":"tag-2-nm-tehnologija","9":"tag-asml","10":"tag-entertainment","11":"tag-izklaide","12":"tag-latvia","13":"tag-latvian","14":"tag-latviesu","15":"tag-latviesu-valoda","16":"tag-latviesuvaloda","17":"tag-latvija","18":"tag-lv","19":"tag-mikroshemu-razosana","20":"tag-rentgenstaru-litografija","21":"tag-substrate"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@lv\/115475153115106042","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts\/37105","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/comments?post=37105"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts\/37105\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/media\/37106"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/media?parent=37105"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/categories?post=37105"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/tags?post=37105"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}