AMD saskaras ar tiesved\u012bbu saist\u012bb\u0101 ar 3D V-Cache tehnolo\u0123iju<\/p>\n
Tehnolo\u0123iju gigants AMD non\u0101cis juridisku probl\u0113mu krustcel\u0113s. Komp\u0101nija Adeia, kas ir patentsv\u0113rt\u012bbu \u012bpa\u0161niece vair\u0101k\u0101s savienojumu tehnolo\u0123ij\u0101s, ir iesniegusi divas tiesas pr\u0101vas pret AMD, apgalvojot, ka uz\u0146\u0113mums savos jaun\u0101kajos procesoros, \u012bpa\u0161i tajos, kas izmanto 3D V-Cache arhitekt\u016bru, p\u0101rk\u0101pj desmit Adeia patentus. \u0160is solis sekojis p\u0113c ilgsto\u0161\u0101m un neveiksm\u012bg\u0101m sarun\u0101m par licences nosl\u0113g\u0161anu, kas norisin\u0101ju\u0161\u0101s vair\u0101ku gadu garum\u0101.<\/p>\n
Apgalvojumi par patentu p\u0101rk\u0101pumiem<\/p>\n
Adeia apgalvo, ka AMD izmanto tehnolo\u0123ijas, kas nelikum\u012bgi aizskar vi\u0146u intelektu\u0101lo \u012bpa\u0161umu. Konkr\u0113t\u0101k, septi\u0146i no desmit patentiem ir saist\u012bti ar hibr\u012bdajiem mikrosh\u0113mu savienojumiem, savuk\u0101rt atliku\u0161ie tr\u012bs skar lo\u0123isko mikrosh\u0113mu un atmi\u0146as mikrosh\u0113mu ra\u017eo\u0161anas procesus. \u0160ie apgalvojumi ir \u012bpa\u0161i noz\u012bm\u012bgi, \u0146emot v\u0113r\u0101 3D V-Cache arhitekt\u016bras lomu AMD procesoru snieguma uzlabo\u0161an\u0101, \u012bpa\u0161i sp\u0113\u013cu un serveru segment\u0101, kur t\u0101 nodro\u0161ina izcilu k\u013c\u016bdainu datu kopumu (cache) pieaugumu un augst\u0101ku integr\u0101cijas bl\u012bvumu.<\/p>\n
Kas ir hibr\u012bd\u0101 savienojuma tehnolo\u0123ija?<\/p>\n
Hibr\u012bd\u0101 savienojuma tehnolo\u0123ija, ko bie\u017ei d\u0113v\u0113 par hibr\u012bdo bondu (hybrid bonding), ir galvenais komponents, kas nodro\u0161ina AMD 3D V-Cache arhitekt\u016bras priek\u0161roc\u012bbas. At\u0161\u0137ir\u012bb\u0101 no tradicion\u0101lajiem savienojuma veidiem, kur izmanto lod\u012b\u0161u savienojumus, hibr\u012bdaj\u0101 metod\u0113 vara un dielektrisk\u0101s virsmas tiek tie\u0161i savienotas starp krist\u0101liem. Tas veido gandr\u012bz monol\u012btu strukt\u016bru ar mikronu precizit\u0101ti, \u013caujot efekt\u012bvi integr\u0113t 64 MB SRAM (Static Random-Access Memory) virs katra Zen skait\u013co\u0161anas modu\u013ca, vienlaikus samazinot karstuma veido\u0161anos un elektriskos zudumus. Tiek uzskat\u012bts, ka AMD \u0161o risin\u0101jumu \u012bsteno, izmantojot TSMC (Taiwan Semiconductor Manufacturing Company) SoIC tehnolo\u0123iju, kas ir pla\u0161a hibr\u012bdo savienojumu procesu saime, nodro\u0161inot \u013coti bl\u012bvu 3D komponentu integr\u0101ciju.<\/p>\n
Adeia patentu v\u0113sture un noz\u012bm\u012bba<\/p>\n
Adeia, kas agr\u0101k bija da\u013ca no Xperi, lepojas ar iespaid\u012bgu patentu portfe\u013cu mikrosh\u0113mu savienojumu tehnolo\u0123ij\u0101s, tostarp DBI un ZiBond. \u0160\u012bs tehnolo\u0123ijas jau ir veiksm\u012bgi licenc\u0113tas pasaules m\u0113roga atmi\u0146as, CMOS sensoru un 3D NAND ra\u017eot\u0101jiem. Tagad Adeia apgalvo, ka AMD sav\u0101s inov\u0101cij\u0101s pla\u0161i izmanto tos pa\u0161us principus, un uzskata, ka vi\u0146u izstr\u0101dne ir iev\u0113rojami veicin\u0101jusi 3D V-Cache procesoru pan\u0101kumus. Tas liek aizdom\u0101ties, vai k\u0101ds patiesi inovat\u012bvs risin\u0101jums ir balst\u012bts uz vi\u0146u patent\u0113to ideju izmanto\u0161anu.<\/p>\n
Potenci\u0101l\u0101s sekas un n\u0101kotnes perspekt\u012bvas<\/p>\n
Hibr\u012bd\u0101 savienojuma tehnolo\u0123ija tiek uzskat\u012bta par n\u0101kotnes mikrosh\u0113mu att\u012bst\u012bbas pamatu, jo veiktsp\u0113jas pieaugums arvien vair\u0101k ir atkar\u012bgs no vertik\u0101l\u0101s integr\u0101cijas, nevis tikai no tranzistoru skaita palielin\u0101\u0161anas. AMD ir paredz\u0113jis \u0161o pieeju sav\u0101s n\u0101kotnes att\u012bst\u012bbas pl\u0101nos, ne tikai Ryzen s\u0113rijai, bet ar\u012b EPYC serveru procesoriem un n\u0101kam\u0101s paaudzes pa\u0101trin\u0101t\u0101jiem, kas apvienos skait\u013co\u0161anas kodolus, atmi\u0146u un I\/O modu\u013cus vien\u0101 blok\u0101. Ja tiesa nost\u0101sies Adeia pus\u0113, \u0161is gad\u012bjums var\u0113tu noteikt robe\u017eas starp pa\u0161\u0101m izstr\u0101d\u0101t\u0101m savienojumu tehnolo\u0123ij\u0101m un atkar\u012bbu no ra\u017eot\u0101ja, piem\u0113ram, TSMC, procesiem. \u0160is jaut\u0101jums var\u0113tu ietekm\u0113t ne tikai AMD, bet ar\u012b citus ra\u017eot\u0101jus, kuri izmanto hibr\u012bdo bondu, s\u0101kot no Intel Foveros Direct un beidzot ar n\u0101kamo paaud\u017eu mobilaj\u0101m mikrosh\u0113m\u0101m.<\/p>\n
Advok\u0101tu strat\u0113\u0123ija un prognozes<\/p>\n
Eksperti gan prognoz\u0113, ka \u0161obr\u012bd AMD produkciju tiesas spriedums tie\u0161i neietekm\u0113s. Tiesu aizliegumi \u0161\u0101dos patentu str\u012bdos ir retums, \u012bpa\u0161i p\u0113c precedents eBay pret MercExchange, un tiesved\u012bbas process var ilgt gadiem. Paredzams, ka AMD un vi\u0146u partneru pirmie so\u013ci b\u016bs patentu apstr\u012bd\u0113\u0161ana, izmantojot ASV Patentu un pre\u010du z\u012bmju biroja (USPTO) P\u0101rskat\u012b\u0161anas padomes patentu p\u0101rs\u016bdz\u0113\u0161anas proced\u016bru. Vi\u0146i, visticam\u0101k, cent\u012bsies pier\u0101d\u012bt, ka Adeia patentus ir p\u0101r\u0101k pla\u0161i formul\u0113ti vai ka tie jau ir ietverti eso\u0161ajos TSMC ra\u017eo\u0161anas procesos. Tas ir sare\u017e\u0123\u012bts juridisks un tehnolo\u0123isks tand\u0113ms, kura izn\u0101kums b\u016bs \u013coti interesants tehnolo\u0123iju pasaulei.<\/p>\n","protected":false},"excerpt":{"rendered":"AMD saskaras ar tiesved\u012bbu saist\u012bb\u0101 ar 3D V-Cache tehnolo\u0123iju Tehnolo\u0123iju gigants AMD non\u0101cis juridisku probl\u0113mu krustcel\u0113s. Komp\u0101nija Adeia,…\n","protected":false},"author":2,"featured_media":40119,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[9709,11617,5089,77,76,11619,35,39,38,36,37,34,40,11618],"class_list":{"0":"post-40118","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-bizness","8":"tag-3d-v-cache","9":"tag-adeia","10":"tag-amd","11":"tag-bizness","12":"tag-business","13":"tag-hibrida-savienojuma-tehnologija","14":"tag-latvia","15":"tag-latvian","16":"tag-latviesu","17":"tag-latviesu-valoda","18":"tag-latviesuvaloda","19":"tag-latvija","20":"tag-lv","21":"tag-patentus"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@lv\/115492985394156426","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts\/40118","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/comments?post=40118"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/posts\/40118\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/media\/40119"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/media?parent=40118"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/categories?post=40118"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/lv\/wp-json\/wp\/v2\/tags?post=40118"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}