The module, known as the QS91, is designed for use in Linux-based Internet of Things (IoT) and industrial automation systems, where developers require a balance of performance, security and energy efficiency. Measuring 27mm by 27mm with a height of 2.6mm, the unit is intended for space-constrained designs and is supplied in a solderable format.
Built around a single-core 64-bit Arm Cortex-A55 processor running at 1.4GHz, the QS91 is positioned as an entry-level option within NXP’s i.MX 9 series. It integrates 512MB of LPDDR4 memory and 4GB of eMMC flash storage, supporting a range of industrial and smart home applications.
The module’s design uses a QFN-style package with 100 pads on a 1mm pitch, providing both electromagnetic compatibility and effective heat dissipation. According to the company, the underside ground pad helps transfer heat, reducing the need for additional cooling components in many applications.
David Pashley, co-founder and managing director of Direct Insight, said: “With the spiralling cost of RAM due to the AI boom driving up the cost of embedded modules, some applications need more cost-effective and pragmatic solutions – and the QS91’s design offers energy efficiency and reduced cost, in comparison to the i.MX 93-based QS93.
“As the entry point into NXP’s i.MX 9 series, the single-core i.MX 91 applications processor delivers an optimised blend of security, features, and low-power performance to enable developers to quickly create new Linux-based IoT edge devices – but also provides the extensibility and ease of programming for applications to evolve over time.”
Manufactured by Aachen-based Ka-Ro Electronics, a long-standing partner of Direct Insight, the QS91 includes a range of connectivity options such as dual USB interfaces, CAN-FD and Gigabit Ethernet. Display support is provided through an RGB parallel interface.
Security features are built into the processor, with NXP’s EdgeLock secure enclave offering a hardware-based root of trust for protection against both physical and network threats.
The module supports an operating temperature range of -25°C to +85°C and requires a single 3.3V power supply. A dedicated evaluation kit, the QS91 QSBASE1 Evalkit, is available to support development, including a Linux board support package.
Alongside the solderable version, a SODIMM-based module, the TX91, has also been introduced, providing additional flexibility for developers.
The launch reflects increasing demand for compact, energy-efficient embedded computing platforms, particularly in applications where cost, power consumption and system footprint are critical design factors.