![\"Forlinx](\"https:\/\/www.cnx-software.com\/wp-content\/uploads\/2026\/04\/Forlinx-UP4-system-on-module.jpg\" "\\"Forlinx")
<\/a><\/p>\nForlinx UP4 specifications:<\/p>\n
SoC<\/p>\n
FET-MX9352-UP4 \u2013 NXP i.MX 9352<\/a> with 2x Arm Cortex-A55 cores @ up to 1.7 GHz, Cortex-M33 real-time core @ 250 MHz, 2D GPU only, 0.5 TOPS Arm Ethos U65 microNPU System Memory \/ Storage<\/p>\n NXP \u2013 1GB LPDDR4 + 8GB eMMC flash LCC castellated holes and LGA pads<\/p>\n Storage<\/p>\n Up to 2x SD\/SDIO Display<\/p>\n HDMI 2.0 up to 4096\u00d72304 @ 60Hz\u00a0 (Rockchip RK3568\/Allwinner T527N) Camera<\/p>\n Up to 4x MIPI CSI Audio<\/p>\n Up to 3x\u00a0 SAI or 4x I2S, depending on SoC Networking \u2013 Up to 2x Gigabit Ethernet, one with optional TSN (NXP); RJ3562J: GbE + FE instead Up to 2x USB 2.0 Host\/OTG PCIe \u2013 Up to 2x PCIe Gen3 x2 (RK3568) or 1x PCIe Gen2.1 x1 (RK3562\/T527N\/T536) Up to 10x UART Debugging \u2013 JTAG (NXP only)<\/p>\n Supply Voltage \u2013 5V It\u2019s not the first time we\u2019ve seen a hybrid LCC + BGA design for system-on-modules, and earlier examples include the MYIR Tech MYC-YR3562<\/a> and Forlinx FET-MA35-S2<\/a>. Here, the company provides various processor options for the same design, so it should be easier to evaluate various solutions during development. It offers an alternative to the OSM Size L standard (<\/a>45x45mm with 662 contacts), with a smaller footprint, but offering fewer I\/Os and not being an industry standard.<\/p>\n I\u00a0 initially assumed it would allow easier switching between variants later on in case of unexpected technical or logistical issues, or simply to provide different variants of a specific product. But in practice, while all modules share the same footprint, they are only pin-to-pin compatible with a few common interfaces, such as dual Ethernet, USB 2.0, a few I2C, SPI, UART, and so on, and differ a lot in terms of I\/O capabilities. Multimedia capabilities also vary, with some only equipped with a 2D GPU,\u00a0 while others feature a 3D GPU.<\/p>\n The FET-MX9352-UP4 targets industrial applications, the FET3568-UP4 high-performance edge AI, the FET3562J-UP4 industrial AI and vision, the GET527N-UP4 high-performance edge computing, and the FET536-UP4 industrial AI and vision.<\/p>\n Software support also varies. Forlinx lists Linux 5.10.198 + Qt 5.15.8 for the T536 module, Linux 5.15.104 + Qt 5.12.5 for the T527N SoM, Linux 6.1.36 + Qt 6.5.0 for the NXP module, Linux 5.10.160 + Qt 5.15.8 for the RK3568 module, and Linux 5.10.198 + Qt 5.15 for the RK3562 SoM. Unsurprisingly, NXP has the most recent software package.<\/p>\n The company has yet to provide pricing or a product page for each of the modules, and instead, you can find an overview and product briefs on a dedicated page<\/a> for the Forlinx UP4 system-on-module family.<\/p>\n Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.<\/p>\n Support CNX Software! Donate via cryptocurrencies<\/a>, become a Patron<\/a> on Patreon, or purchase goods on Amazon<\/a> or Aliexpress<\/a>. We also use affiliate links in articles to earn commissions if you make a purchase after clicking on those links.<\/p>\n","protected":false},"excerpt":{"rendered":"Forlinx Embedded UP4 is a new family of pin-to-pin compatible system-on-modules currently offered with Rockchip RK3568J\/RK3562J, NXP i.MX…\n","protected":false},"author":2,"featured_media":7870,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[62],"tags":[6759,2728,6760,6761,6762,6763,6764,166,6765,6766,6767],"class_list":{"0":"post-7869","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-nxp","8":"tag-allwinner","9":"tag-edge-ai","10":"tag-forlinx","11":"tag-hmi","12":"tag-industrial","13":"tag-linux","14":"tag-networking","15":"tag-nxp","16":"tag-qt","17":"tag-rockchip","18":"tag-som"},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/posts\/7869","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/comments?post=7869"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/posts\/7869\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/media\/7870"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/media?parent=7869"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/categories?post=7869"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/netherlands\/wp-json\/wp\/v2\/tags?post=7869"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}
\nFET3568-UP4 \u2013 Rockchip RK3568B2<\/a>\/J with 4x Arm Cortex-A55 cores @ up to 2.0\/1.8 GHz, Arm Mali-G52 MP2 3D GPU, 1 TOPS AI NPU
\nFET3562J-UP4 \u2013 Rockchip RK3562J<\/a> with 4x Arm Cortex-A53 cores @ 1.8 GHz,\u00a0 Arm Mali-G52-2EE 3D GPU, 1 TOPS NPU
\nFET527N-UP4 \u2013 Allwinner T527N<\/a> with octa-core CPU (4x Arm Cortex-A55 cores @ 1.8GHz + 4x Arm Cortex-A55 cores @ 1.4GHz), 200 MHz RISC-V core, 600MHz HiFi4 DSP, Arm G57 MC1 3D GPU, and 2 TOPS NPU
\nFET536-UP4 \u2013 Allwinner T536<\/a> with 4x Arm Cortex-A55 cores @ up to 1.6GHz, 600 MHz RISC-V core, low-power RISC-V core, 2D GPU, 2 TOPS NPU<\/p>\n
\nRockchip RK3568 \u2013 4GB or 8GB LPDDR4X + 32GB or 64GB eMMC flash
\nRockchip RK3562J \u2013 1GB or 2GB LPDDR4 + 8GB or 16GB eMMC flash
\nAllwinner T527N \u2013 2GB or4GB LPDDR4 + 16GB or 32GB eMMC flash<\/p>\n
\nFSPI for serial NOR\/NAND flash (Rockchip only)
\nUp to 3x SATA (Rockchip only)<\/p>\n
\n24-bit parallel RGB up to 1280 x 800 @ 60 Hz,\u00a0 1366 x 768 @ 60 Hz, or 1920 x 1080 @ 60 Hz depending on SoC
\nLVDS up to 1280 x 800 @ 60 Hz, 1366 x 768 @ 60 Hz, or 1920 x 1080 @ 60 Hz depending on SoC
\nUp to 2x 4-lane MIPI DSI up to 1920 x 1080 @ 60 Hz or 2048 x 1080 @ 60Hz depending on SoC
\neDP 1.3 up to 2560 x 1600 @ 60Hz (Rockchip RK3568) or 4K @ 30 Hz (Allwinner T527N)<\/p>\n
\nParallel CSI (Allwinner only)<\/p>\n
\nUp to 2x MQS (NXP only)
\nUp to 3x PDM, up to 2x 8-channel DMIC (Allwinner T527N)
\nUp to 1x S\/PDIF (Rockchip RK3562)
\nBuilt-in audio codec (Rockchip RK3562\/Allwinner T536)
\nUp to 1x single-wire audio (Allwinner only)<\/p>\n
\nUSB<\/p>\n
\nUp to 2x USB 3.0<\/p>\n
\nLow-speed I\/Os<\/p>\n
\nUp to 3x CAN 2.0B
\nUp to 8x I2C, 2x I3C (NXP only)
\nUp to 8x SPI
\nUp to 28x ADC (the number of ADCs highly depends on the selected SoC; Allwinner T536 has the most)
\nUp to 34x PWM (the number of PWMs highly depends on the selected SoC; Allwinner T536has the most)
\nUp to 1x IR Tx, up to 4x Rx (Infrared on Allwinner only)<\/p>\n
\nDimensions \u2013 40 x 40 x 1.2 mm
\nTemperature Range \u2013 -40\u00b0C ~ +85\u00b0C<\/p>\n<\/a>NXP i.MX 9352 UF4 SoM (FET-MX9352-UP4)<\/p>\n<\/a>Five different processors targeting industrial, edge AI, AI vision, and edge computing applications<\/p>\n<\/a>Carrier board image provided by Forlinx (clearly AI-generated)<\/p>\n<\/p>\n