{"id":161813,"date":"2026-04-20T17:32:06","date_gmt":"2026-04-20T17:32:06","guid":{"rendered":"https:\/\/www.europesays.com\/ro\/161813\/"},"modified":"2026-04-20T17:32:06","modified_gmt":"2026-04-20T17:32:06","slug":"memorii-ram-hudimm-cu-performanta-la-jumatate","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/ro\/161813\/","title":{"rendered":"memorii RAM HUDIMM cu performan\u021b\u0103 la jum\u0103tate"},"content":{"rendered":"<p>Explozia cererii din industria de inteligen\u021b\u0103 artificial\u0103 a generat un efect de domino, ridic\u00e2nd semnificativ costurile de produc\u021bie pentru componentele esen\u021biale ale calculatoarelor. Pentru a contracara aceast\u0103 criz\u0103 a pre\u021burilor, anumi\u021bi produc\u0103tori aleg s\u0103 reg\u00e2ndeasc\u0103 fundamental arhitectura echipamentelor de baz\u0103. Compania ASRock, \u00een colaborare cu <a href=\"https:\/\/www.connect.ro\/2022\/01\/22\/intel-intrerupe-suportul-pentru-discurile-blu-ray-uhd-in-cele-mai-noi-cipuri-pentru-pc\/\" rel=\"nofollow noopener\" target=\"_blank\">Intel<\/a> \u0219i TeamGroup, a dezv\u0103luit o specifica\u021bie tehnic\u0103 inedit\u0103: HUDIMM, un acronim pentru o memorie cu magistral\u0103 \u00eenjum\u0103t\u0103\u021bit\u0103.<\/p>\n<p>Modific\u0103rile aduse acestui standard sunt considerabile \u0219i vizeaz\u0103 o reducere drastic\u0103 a materialelor din siliciu folosite \u00een procesul de fabrica\u021bie. Solu\u021bia este destinat\u0103 exclusiv segmentului de PC-uri accesibile, unde utilizatorii caut\u0103 pre\u021buri mici \u00een detrimentul performan\u021bei ridicate. O unitate de memorie DDR5 conven\u021bional\u0103 se bazeaz\u0103 pe dou\u0103 subcanale independente de 32 de bi\u021bi. Acestea lucreaz\u0103 sincronizat pentru a satura o magistral\u0103 complet\u0103 de 64 de bi\u021bi, form\u00e2nd un r\u00e2nd complet de memorie. Varianta de buget propus\u0103 recent elimin\u0103 pur \u0219i simplu jum\u0103tate din aceast\u0103 structur\u0103 logic\u0103 \u0219i fizic\u0103 a modulului.<\/p>\n<blockquote class=\"twitter-tweet\" data-width=\"500\" data-dnt=\"true\">\n<p lang=\"en\" dir=\"ltr\">\ud83d\ude80 ASRock Drives DDR5 Innovation with Self-Developed HUDIMM Technology<\/p>\n<p>ASRock introduces its self-developed One Sub-Channel (1\u00d732-bit) DDR5 HUDIMM design, now supported on Intel 600 \/ 700 \/ 800 series motherboards.<\/p>\n<p>Unlike standard DDR5 (2\u00d732-bit), ASRock\u2019s HUDIMM architecture\u2026 <a href=\"https:\/\/t.co\/Kbt9ue0RKZ\" rel=\"nofollow\">pic.twitter.com\/Kbt9ue0RKZ<\/a><\/p>\n<p> \u2014 ASRock (@ASRockInfo) <a href=\"https:\/\/twitter.com\/ASRockInfo\/status\/2045155333849391163?ref_src=twsrc%5Etfw\" rel=\"nofollow noopener\" target=\"_blank\">April 17, 2026<\/a><\/p><\/blockquote>\n<p>Noul standard folose\u0219te un singur canal de 32 de bi\u021bi, o decizie care taie direct la jum\u0103tate at\u00e2t l\u0103\u021bimea de band\u0103 disponibil\u0103, c\u00e2t \u0219i capacitatea modulelor. Aceast\u0103 arhitectur\u0103 simplificat\u0103 permite asamblarea unor memorii folosind mult mai pu\u021bine cipuri, reduc\u00e2nd substan\u021bial costul final. Componentele reduse sunt recunoscute oficial de pl\u0103cile de baz\u0103 dotate cu cipseturi Intel din familiile 600, 700 \u0219i 800.<\/p>\n<p>Sunt preg\u0103tite at\u00e2t versiuni pentru <a href=\"https:\/\/www.connect.ro\/2022\/01\/21\/logitech-lanseaza-tastatura-si-mouse-ul-pop-cele-mai-noi-din-gama-studio-series-pret-si-disponibilitate\/\" rel=\"nofollow noopener\" target=\"_blank\">PC<\/a>, c\u00e2t \u0219i pentru laptopuri sau calculatoare ultra-compacte. Acelea vor purta denumirea HSODIMM. Dincolo de limit\u0103rile evidente de vitez\u0103, platforma beneficiaz\u0103 de un suport flexibil \u0219i inovator la nivelul interfe\u021bei BIOS. Sistemul de operare \u0219i placa de baz\u0103 permit o func\u021bionare dual-channel complet asimetric\u0103, amestec\u00e2nd module vechi cu module noi.<\/p>\n<p>Utilizatorii pot monta o memorie de 8 GB l\u00e2ng\u0103 una complet\u0103 de 16 GB pentru a activa un mod de lucru cu trei subcanale simultane. Configura\u021bia rezultat\u0103 este teoretic superioar\u0103 unui singur modul izolat, ajut\u00e2nd la asamblarea unor sisteme de tranzi\u021bie. Totu\u0219i, materialele promo\u021bionale publicate de companie arat\u0103 o laten\u021b\u0103 de 90 de nanosecunde, o valoare considerat\u0103 destul de lent\u0103 pentru standardele actuale de pe pia\u021b\u0103.<\/p>\n<p>Conceptul atrage deja aten\u021bia altor juc\u0103tori majori din segmentul hardware, care caut\u0103 modalit\u0103\u021bi de a oferi sisteme mai ieftine clien\u021bilor. Reprezentan\u021bii diviziei de cercetare de la <a href=\"https:\/\/www.connect.ro\/2021\/11\/26\/premiile-connect-2021-castigatori\/\" rel=\"nofollow noopener\" target=\"_blank\">Asus<\/a> au experimentat aceast\u0103 tehnologie pe o plac\u0103 de baz\u0103 performant\u0103 din gama ROG Maximus Z890 Apex. Experimentul a demonstrat o deschidere clar\u0103 c\u0103tre adoptarea viitoare a tehnologiei.<\/p>\n<p>Folosind o metod\u0103 neconven\u021bional\u0103, un tehnician a izolat cu band\u0103 adeziv\u0103 pinii de contact ai unor memorii obi\u0219nuite pentru a opri comunicarea cu jum\u0103tate din cipurile integrate. Sistemul a \u00eenregistrat imediat sc\u0103derea capacit\u0103\u021bii de la 48 GB la doar 24 GB, valid\u00e2nd func\u021bionarea arhitecturii limitate. P\u00e2n\u0103 \u00een acest moment, produc\u0103torii implica\u021bi nu au comunicat date concrete despre disponibilitatea comercial\u0103 \u00een magazine sau despre nivelul exact al reducerilor de pre\u021b oferite clien\u021bilor.<\/p>\n<p><script async src=\"https:\/\/platform.twitter.com\/widgets.js\" charset=\"utf-8\"><\/script><\/p>\n","protected":false},"excerpt":{"rendered":"Explozia cererii din industria de inteligen\u021b\u0103 artificial\u0103 a generat un efect de domino, ridic\u00e2nd semnificativ costurile de produc\u021bie&hellip;\n","protected":false},"author":2,"featured_media":161814,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[40875,14857,10140,47012,3645,2892,41,40,38,39,47013,141,124],"class_list":{"0":"post-161813","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-tehnologie","8":"tag-asrock","9":"tag-componente-pc","10":"tag-ddr5","11":"tag-hudimm","12":"tag-intel","13":"tag-memorie-ram","14":"tag-ro","15":"tag-romana","16":"tag-romania","17":"tag-romanian","18":"tag-teamgroup","19":"tag-technology","20":"tag-tehnologie"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@ro\/116438233464893215","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts\/161813","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/comments?post=161813"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts\/161813\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/media\/161814"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/media?parent=161813"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/categories?post=161813"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/tags?post=161813"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}