{"id":56597,"date":"2025-12-03T08:08:07","date_gmt":"2025-12-03T08:08:07","guid":{"rendered":"https:\/\/www.europesays.com\/ro\/56597\/"},"modified":"2025-12-03T08:08:07","modified_gmt":"2025-12-03T08:08:07","slug":"breveteaza-cipuri-de-2-nm-fara-tehnologie-occidentala","status":"publish","type":"post","link":"https:\/\/www.europesays.com\/ro\/56597\/","title":{"rendered":"breveteaz\u0103 cipuri de 2 nm f\u0103r\u0103 tehnologie occidental\u0103"},"content":{"rendered":"<p>\u00centr-o mi\u0219care ce ar putea rescrie echilibrul de putere \u00een industria global\u0103 a semiconductorilor, <a href=\"https:\/\/www.connect.ro\/2022\/01\/28\/huawei-p50-pro-huawei-p50-pocket-lansare-romania-pret-specificatii\/\" rel=\"nofollow noopener\" target=\"_blank\">Huawei<\/a> a depus un brevet care schi\u021beaz\u0103 calea c\u0103tre produc\u021bia de cipuri cu litografie pe 2 nm, folosind exclusiv tehnologia cu ultraviolete profunde (DUV), considerat\u0103 \u00eenvechit\u0103. Aceast\u0103 strategie este o consecin\u021b\u0103 direct\u0103 a sanc\u021biunilor occidentale severe, care interzic accesul companiei chineze la echipamentele avansate de litografie cu ultraviolete extreme (EUV) produse de compania olandez\u0103 ASML, considerate standardul pentru nodurile de fabrica\u021bie ultramoderne.<\/p>\n<p>Brevetul, depus ini\u021bial \u00een 2022 dar devenit public abia recent, a fost identificat de cercet\u0103torul veteran Dr. Frederick Chen. Documentul descrie o tehnic\u0103 sofisticat\u0103 de \u201emulti-patterning\u201d (modelare multipl\u0103) care ar permite Huawei \u0219i partenerului s\u0103u de produc\u021bie, SMIC, s\u0103 ating\u0103 un pas metalic extrem de redus, de 21 nm. Aceast\u0103 dimensiune critic\u0103 plaseaz\u0103 poten\u021bialele cipuri la egalitate cu procesele de clas\u0103 2 nm preg\u0103tite de gigan\u021bii TSMC \u0219i <a href=\"https:\/\/www.connect.ro\/2022\/01\/23\/samsung-a-scapat-galaxy-tab-s8-ultra-pe-propriul-site-web\/\" rel=\"nofollow noopener\" target=\"_blank\">Samsung<\/a>, care \u00eens\u0103 depind total de tehnologia EUV interzis\u0103 Chinei.<\/p>\n<p>Nucleul acestei inova\u021bii este un flux optimizat de tip \u201eSelf-Aligned Quadruple Patterning\u201d (SAQP). Aceast\u0103 metod\u0103 ingenioas\u0103 reduce num\u0103rul de expuneri DUV necesare la doar patru, o \u00eembun\u0103t\u0103\u021bire semnificativ\u0103 fa\u021b\u0103 de schemele conven\u021bionale de modelare multipl\u0103, care sunt adesea extrem de complexe \u0219i ineficiente. Prin \u00eempingerea infrastructurii DUV existente la limitele sale absolute, Huawei sper\u0103 s\u0103 fac\u0103 un salt tehnologic direct de la actualul cip Kirin 9030 la o genera\u021bie viitoare de 2 nm, ocolind complet necesitatea utilajelor EUV restric\u021bionate.<\/p>\n<p>\u00cen ciuda entuziasmului st\u00e2rnit de aceast\u0103 descoperire teoretic\u0103, exper\u021bii din industrie r\u0103m\u00e2n rezerva\u021bi cu privire la viabilitatea comercial\u0103. Procesul de modelare cvadrupl\u0103 la dimensiuni at\u00e2t de mici este notoriu pentru randamentul sc\u0103zut (low yield), ceea ce duce la costuri de produc\u021bie astronomice comparativ cu procesul EUV cu expunere unic\u0103. Acesta este motivul principal pentru care restul industriei a migrat deja c\u0103tre EUV pentru nodurile de 3 nm \u0219i mai mici.<\/p>\n<p>Totu\u0219i, dac\u0103 Huawei reu\u0219e\u0219te s\u0103 transpun\u0103 aceast\u0103 re\u021bet\u0103 \u00eentr-o produc\u021bie de volum, ar reprezenta un act remarcabil de sfidare \u00een fa\u021ba SUA, care a pus compania pe \u201eEntity List\u201d, \u0219i un pas major c\u0103tre autosuficien\u021ba Chinei \u00een domeniul semiconductorilor.<\/p>\n","protected":false},"excerpt":{"rendered":"\u00centr-o mi\u0219care ce ar putea rescrie echilibrul de putere \u00een industria global\u0103 a semiconductorilor, Huawei a depus un&hellip;\n","protected":false},"author":2,"featured_media":56598,"comment_status":"","ping_status":"","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[16],"tags":[15814,21815,156,21816,41,40,38,39,13245,21817,21818,141,124,21819],"class_list":{"0":"post-56597","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-tehnologie","8":"tag-cipuri-2nm","9":"tag-euv","10":"tag-huawei","11":"tag-litografie-duv","12":"tag-ro","13":"tag-romana","14":"tag-romania","15":"tag-romanian","16":"tag-sanctiuni-sua","17":"tag-semiconductori-china","18":"tag-smic","19":"tag-technology","20":"tag-tehnologie","21":"tag-tehnologie-saqp"},"share_on_mastodon":{"url":"https:\/\/pubeurope.com\/@ro\/115654616859369959","error":""},"_links":{"self":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts\/56597","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/comments?post=56597"}],"version-history":[{"count":0,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/posts\/56597\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/media\/56598"}],"wp:attachment":[{"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/media?parent=56597"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/categories?post=56597"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.europesays.com\/ro\/wp-json\/wp\/v2\/tags?post=56597"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}