MediaTek unveiled its vision for integrating artificial intelligence across devices—from edge computing to the cloud—at this year’s Computex trade show, emphasizing practical applications in connectivity, multimedia, and automotive technologies.
Dr. Rick Tsai, MediaTek vice chairman and chief executive, kicked off the event with a keynote focused on AI, 6G, and hybrid computing. “We are looking forward to highlighting MediaTek’s long-standing expertise in connectivity, computing, and multimedia products and technologies,” said Joe Chen, MediaTek president and chief operating officer.
A key highlight was MediaTek’s hybrid computing model, designed to connect computing power with communications infrastructure to reduce data silos in AI ecosystems. The company demonstrated the first 5G generative AI gateway device, merging its 5G fixed wireless access platform with local AI processing capabilities. The prototype, developed with a major telecom infrastructure partner, earned a Best Choice Award at Computex.
AI chip. CONTRIBUTED GRAPHICS
MediaTek also previewed an edge-cloud collaboration with NVIDIA. The setup, combining radio access nodes and device-based computing, aims to improve privacy and reduce latency in AI agent interactions.
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In the cloud space, MediaTek is working with NVIDIA on the Grace Blackwell GB10 superchip, part of the DGX Spark platform, which targets desktop-based AI developers. The system can run AI models with up to 200 billion parameters and is touted as the world’s smallest AI supercomputer.
For automotive applications, the MediaTek Dimensity Auto platform introduced the C-X1 chipset, designed to power AI voice assistants and 8K multimedia features in vehicles. A separate chip, the MT2739, features 5G dual-SIM support and real-time network switching to enhance driving connectivity. The company also previewed a next-gen emergency call feature that automatically alerts responders after severe crashes.
In the IoT sector, MediaTek’s Genio platform supports generative AI for smart home, retail, and industrial devices. The updated Genio 720 and 520 chips will be featured in projects with partners including Advantech, ADLINK, and VIA.
Additional innovations included antenna-sharing tech between smartphones and wearables to improve 5G and 6G signal reception indoors. Its Filogic Wi-Fi system now uses AI to manage bandwidth more efficiently across multiple connected devices.
On the multimedia front, MediaTek introduced its mini-LED display SoC for large screens and an 8K 60Hz AI video scaler. These technologies aim to boost image quality, power efficiency, and display performance across commercial and consumer applications.