ADLINK launches compact cExpress-R8 computing moduleEngineered to satisfy the requirements of intelligent industrial applications, it is powered by AMD Ryzen Embedded 8000 Series processors (8845HS, 8840U, 8645HS, and 8640U). The modules are designed to enable improved graphics, accelerated edge computing, and mission-critical AI deployments while maintaining high performance and energy efficiency.

With an XDNA NPU, integrated AMD RDNA 3 graphics, and up to 8 “Zen 4” cores and 16 threads, ADLINK’s cExpress-R8 can produce up to 40 TOPS. In the fields of machine vision, robotics, medical imaging, entertainment, and intelligent human-machine systems, the cExpress-R8 powers quick decision-making and power-efficient AI inferencing.

Performance-per-watt efficiency has been optimised with the XDNA architecture, allowing for more complicated AI workloads without a noticeable increase in energy requirements and providing sophisticated AI processing.

The cExpress-R8 supports up to 96GB of DDR5 memory at 5600 MT/s, with both ECC and non-ECC options available, to ensure real-time processing. As a watchdog, ECC finds and fixes mistakes in environments, including POS (Point of Sale)/POI (Point of Information) systems, gaming, transportation, and mission-critical applications.

It supports DP, eDP, HDMI, LVDS, VGA, and up to four displays. The optional VGA and eDP outputs provide a variety of visual configurations to satisfy the needs of edge computing.

A wide variety of edge applications can benefit from the cExpress-R8’s scalable performance, power, and graphics combinations. It also guarantees long-term design stability and lifecycle alignment for system integrator roadmaps with a 10-year product availability.

Key Features:

  • AMD Ryzen Embedded 8000 Series Processors
  • AMD RDNA 3 Graphics and XDNA NPU (up to 40 TOPS performance)
  • Up to 96GB DDR5 5600 MT/s (ECC/non-ECC)
  • Four independent display outputs

In order to facilitate system integration and speed up prototyping, ADLINK’s cExpress development kits, which include reference carriers and complete I/O support, are anticipated to be available in Q4 2025.