Samsung Unveils First 3D Memory to Eliminate Bottlenecks by Stacking HBM, NAND
V10 BV-NAND. Samsung Electronics Samsung Electronics (005930.KS) is aiming to lead the DRAM and NAND flash markets with…
Samsung’s zHBM 3D Memory Concept Forecasts 8X Speed Over HBM5
At the Future of Memory and Storage (FMS) 2026 conference last week in Santa Clara, Samsung…
Samsung, SK Hynix Pledge to Boost Shareholder Returns After Record AI Chip Profits — BigGo Finance
South Korea’s two largest chipmakers, Samsung Electronics (005930.KS) and SK Hynix (000660.KS), are preparing to significantly boost shareholder…
Samsung Unveils zHBM to Lead Big Tech AI Chip Market
Lee Jin-yeop, Vice President of Samsung Electronics’ Flash Development Division, gives a presentation at “FMS 2026” held in…
Samsung unveils zHBM AI memory chip with 8x HBM5 speed
Samsung, the world’s biggest memory chip maker, has unveiled a new memory chip concept called zHBM for future…
“Samsung Is Back”: zHBM Delivers 8x HBM5 Performance, Breaks AI Memory Limits
Kim Kyung-ryun, vice president of Samsung Electronics’ DRAM Development Division, gives a presentation at “FMS 2026” held in…
Samsung Unveils Next-Gen 3D-Memory Vision at FMS 2026, Charting the Future of AI Infrastructure – Samsung Global Newsroom
Samsung Electronics a global leader in advanced memory technology, today showcased its latest AI memory innovations at Future…
Samsung Electronics Set to Unveil ‘zHBM’ Stacking HBM on GPU, Targeting AI Bottleneck Breakthrough — BigGo Finance
Samsung Electronics is preparing to unveil its next-generation 3D memory and storage roadmap designed to resolve performance bottlenecks…